Particle – Wafer Interactions in Semiaqueous Silicon Cleaning Systems

Abstract:

Interfacial interaction forces between particulate contaminants and semiconductor wafer surfaces play a key role in the understanding of post-CMP and post-lapping cleaning processes. In order to facilitate removal and prevent re-deposition of submicron particles on wafer surface, understanding, measurement, and manipulation of these forces is required. The theory of interaction forces in liquids that includes DLVO forces (van der Waals, electrical double layer) and non-DLVO (solvation, hydration, hydrophobic, steric and bridging forces) is well established and is studied elsewhere.1-4 Short range interaction forces between silica surfaces in alcohols have been successfully measured before using AFM.5-7

• Periodical: Solid State Phenomena (Volumes 145-146)
• Pages: 77-84
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.145-146.77
• Online since: January 2009
• Authors: Lukasz Hupka, Jakub Nalaskowski, Nishant Sinha, Joseph N. Greeley, Zak Clark, Hao Du, William P. Johnson, Jan D. Miller
• Keywords: Atomic Force Microscope (AFM), Colloidal Probe, Hydrophobic Forces, Interaction Forces, Lateral Force, Molecular Dynamic Simulation, Post CMP Cleaning, Semiaqueous Cleaning, Silicon Cleaning

References

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