Particle – Wafer Interactions in Semiaqueous Silicon Cleaning Systems

Lukasz Hupka; Jakub Nalaskowski; Nishant Sinha; Joseph N. Greeley; Zak Clark; Hao Du; William P. Johnson; Jan D. Miller

doi:10.4028/www.scientific.net/SSP.145-146.77

Paper Titles

Reduced Particle Removal Efficiency Upon Wafer Storage
p.61

Local Distribution of Particles Deposited on Patterned Surfaces
p.65

Particle Retention Mechanism of Filter in High Temperature Chemical
p.69

Improving Process Control for Copper Electroplating through Filter Membrane Optimization
p.73

Particle – Wafer Interactions in Semiaqueous Silicon Cleaning Systems
p.77

Drying of High Aspect Ratio Structures: A Comparison of Drying Techniques via Electrical Stiction Analysis
p.87

Relationship between Atmospheric Humidity and Watermark Formation in IPA Dry of Si Wafer after HF Clean
p.91

Complementary Metrology within a European Joint Laboratory
p.97

Highly Sensitive Detection of Inorganic Contamination
p.101

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Particle – Wafer Interactions in Semiaqueous Silicon Cleaning Systems

Abstract:

Interfacial interaction forces between particulate contaminants and semiconductor wafer surfaces play a key role in the understanding of post-CMP and post-lapping cleaning processes. In order to facilitate removal and prevent re-deposition of submicron particles on wafer surface, understanding, measurement, and manipulation of these forces is required. The theory of interaction forces in liquids that includes DLVO forces (van der Waals, electrical double layer) and non-DLVO (solvation, hydration, hydrophobic, steric and bridging forces) is well established and is studied elsewhere.1-4 Short range interaction forces between silica surfaces in alcohols have been successfully measured before using AFM.5-7