Local Distribution of Particles Deposited on Patterned Surfaces

Faisal Wali; D. Martin Knotter; Twan Bearda; Paul W. Mertens

doi:10.4028/www.scientific.net/SSP.145-146.65

Paper Titles

Pattern Collapse and Particle Removal Forces of Interest to Semiconductor Fabrication Process
p.47

Applications of Electrostatic Spray Techniques to Surface Cleaning
p.51

Analyzing the Collapse Force of Narrow Lines Measured by Lateral Force AFM Using an Analytical Mechanical Model
p.55

Reduced Particle Removal Efficiency Upon Wafer Storage
p.61

Local Distribution of Particles Deposited on Patterned Surfaces
p.65

Particle Retention Mechanism of Filter in High Temperature Chemical
p.69

Improving Process Control for Copper Electroplating through Filter Membrane Optimization
p.73

Particle – Wafer Interactions in Semiaqueous Silicon Cleaning Systems
p.77

Drying of High Aspect Ratio Structures: A Comparison of Drying Techniques via Electrical Stiction Analysis
p.87

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Local Distribution of Particles Deposited on Patterned Surfaces

Abstract:

In many process steps of integrated circuits (IC’s) fabrication, silicon wafers are coming in contact with process liquids such as ultra pure water (UPW) and aqueous and non-aqueous chemical mixtures. During these process steps, liquid-borne particle contamination can deposit on the wafer surface. Particle contamination from UPW is an important factor influencing random yield loss of IC’s [ ]. A number of yield models are used to predict yields including Poisson, Murphy, Seeds, and negative binomial models [ , ]. However, these models are based on the assumption that particles are randomly deposited on the wafer surface [ ].