Local Distribution of Particles Deposited on Patterned Surfaces

Abstract:

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In many process steps of integrated circuits (IC’s) fabrication, silicon wafers are coming in contact with process liquids such as ultra pure water (UPW) and aqueous and non-aqueous chemical mixtures. During these process steps, liquid-borne particle contamination can deposit on the wafer surface. Particle contamination from UPW is an important factor influencing random yield loss of IC’s [ ]. A number of yield models are used to predict yields including Poisson, Murphy, Seeds, and negative binomial models [ , ]. However, these models are based on the assumption that particles are randomly deposited on the wafer surface [ ].

Info:

Periodical:

Solid State Phenomena (Volumes 145-146)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

65-68

DOI:

10.4028/www.scientific.net/SSP.145-146.65

Citation:

F. Wali et al., "Local Distribution of Particles Deposited on Patterned Surfaces", Solid State Phenomena, Vols. 145-146, pp. 65-68, 2009

Online since:

January 2009

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Price:

$35.00

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