Particle Retention Mechanism of Filter in High Temperature Chemical

Abstract:

Article Preview

Recently, the control of particles measured in the tens of nanometers has become indispensable for manufacturing semiconductor devices. In sulfuric acid - hydrogen peroxide mixture (SPM) processes, it is increasingly important to reduce particles on the wafer. A batch type re-circulation bath has been generally used with a fluoroplastic filter built into the equipment. The pore size of the filter used has gradually become smaller. The particle levels on the wafer have decreased after the filter was changed from a 100nm rating to a 30nm rating.

Info:

Periodical:

Solid State Phenomena (Volumes 145-146)

Edited by:

Paul Mertens, Marc Meuris and Marc Heyns

Pages:

69-72

DOI:

10.4028/www.scientific.net/SSP.145-146.69

Citation:

T. Nagafuchi et al., "Particle Retention Mechanism of Filter in High Temperature Chemical", Solid State Phenomena, Vols. 145-146, pp. 69-72, 2009

Online since:

January 2009

Export:

Price:

$35.00

In order to see related information, you need to Login.