Ultra Clean Processing of Semiconductor Surfaces IX

Volumes 145-146

doi: 10.4028/www.scientific.net/SSP.145-146

Paper Title Page

Authors: Takuya Nagafuchi, Koji Chiba, Isamu Funahashi, Minako Inukai, Hiroaki Yamada, Kaori Umezawa, Hiroshi Tomita

Abstract: Recently, the control of particles measured in the tens of nanometers has become indispensable for manufacturing semiconductor devices. In...

Authors: Ai Wen Wu, Gregg Cornner, Vinay Prabhaker

Abstract: To achieve uniform copper plating on the surface of the wafer consistently in a production lot, a particle-free plating solution must be...

Authors: Lukasz Hupka, Jakub Nalaskowski, Nishant Sinha, Joseph N. Greeley, Zak Clark, Hao Du, William P. Johnson, Jan D. Miller

Abstract: Interfacial interaction forces between particulate contaminants and semiconductor wafer surfaces play a key role in the understanding of...

Authors: Antoine Pacco, Masayuki Wada, Twan Bearda, Paul W. Mertens

Abstract: Nanostructures with high aspect ratios, HAR, (ratio of height to lateral feature size) are of interest for many applications. One of the...

Authors: N. Kurumoto, Atsuro Eitoku, Katsuhiko Miya

Abstract: As the critical dimension of LSI continues to decrease, the surface tension of water and its effect on the formation of watermarks is...

Authors: Andreas Nutsch, Burkhard Beckhoff, Roswitha Altmann, J.A. Van den Berg, D. Giubertoni, Philipp Hönicke, M. Bersani, Andreas Leibold, F. Meirer, Matthias Müller, G. Pepponi, Michael Otto, P. Petrik, M. Reading, Lothar Pfitzner, Heiner Ryssel

Abstract: The continuous dimensional reduction drives the development of metrology, analysis and characterization for nano and micro electronics. An...

Authors: Burkhard Beckhoff, Andreas Nutsch, Roswitha Altmann, G. Borionetti, C. Pello, Maria Luisa Polignano, Davide Codegoni, Salvo Grasso, Elena Cazzini, M. Bersani, P. Lazzeri, S. Gennaro, Michael Kolbe, Matthias Müller, P. Kregsamer, Florian Posch

Abstract: As the detection of inorganic contaminants is of steadily increasing importance for the improvement of yields in microelectronic...

Authors: Hikari Takahara, Ken Tsugane

Abstract: In the semiconductor industry, the edge exclusion of processed wafers is decreasing to accommodate more integrated circuits. With this...

Authors: Adrien Danel, S. Sage, M.C. Roure, D. Peters, Jeff Hawthorne, R. Spicer

Abstract: The monitoring and optimization of wet clean and surface preparation processes is a major challenge in the microelectronics industry [1, 2]....

Authors: Ayako Shimazaki, Hiroki Sakurai, Masao Iwase, Reiko Yoshimura, Tsukasa Tada

Abstract: Contamination control has become a high-centered issue for the fabrication yield, performance and reliability of leading-edge ULSI devices. ...


Showing 21 to 30 of 91 Paper Titles