The Interaction of Sublimed Iminodiacetic Acid with a Cu{110} Surface

D.W. Tee; S.M. Francis; N.V. Richardson; Chris Reid; Larry McGhee

doi:10.4028/www.scientific.net/SSP.145-146.335

Paper Titles

Surface Energy and Wetting Behaviour of Plasma Etched Porous SiCOH Surfaces and Plasma Etch Residue Cleaning Solutions
p.319

Modification of Photoresist by UV for Post-Etch Wet Strip Applications
p.323

Recyclable Fluorine-Based Cleaning Solvents for Resist Removal
p.327

Cu Dendrite Formation in Post Trench Etch Cleaning
p.331

The Interaction of Sublimed Iminodiacetic Acid with a Cu{110} Surface
p.335

Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage
p.339

Electrochemical Behavior of Cobalt in Post-Via Etch Cleaning Solutions
p.343

Characterization of Post Etch Residues Depending on Resist Removal Processes after Aluminum Etch
p.349

Impact of Dry Etch and Ash Conditions on Removability of Plasma Etch Residues in Al-Metallization. Approach to Improve PER Cleaning Efficiency by EHS-Friendly Aqueous Remover
p.353

HomeSolid State PhenomenaSolid State Phenomena Vols. 145-146The Interaction of Sublimed Iminodiacetic Acid...

The Interaction of Sublimed Iminodiacetic Acid with a Cu{110} Surface

Abstract:

Iminodiacetic acid (IMDA), NH(CH2CO2H)2, whose molecular structure is shown in figure 1, is a small molecule but has a very large scope for interacting with copper due to its two carboxylic acid and imine functionalities, which have been shown to bind strongly to copper [1,2,3]. The electronegative oxygen and nitrogen atoms present also make this a good candidate for hydrogen bonding, which often leads to very stable ordered two dimensional (2D) structures being formed across surfaces.