Electrochemical, Physical, and Electrical Characterization of Two Clean Solutions for Cu PCMP Clean

Yun Long Li; Nancy Heylen; Jérôme Daviot; Chris Reid; Leonardus Leunissen

doi:10.4028/www.scientific.net/SSP.187.235

Paper Titles

Influence of Photoresist and BARC Selection on the Efficiency of a Post-Etch Wet Strip in BEOL Applications
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ESH Friendly Solvent for Stripping Positive and Negative Photoresists in 3D-Wafer Level Packaging and 3D-Stacked IC Applications
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Tungsten Oxidation Kinetic after Wet Cleaning: XPS and ToF-SIMS Characterization
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A Comparison between BTA and Amidoximes and their Interactions with Copper Surfaces
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Electrochemical, Physical, and Electrical Characterization of Two Clean Solutions for Cu PCMP Clean
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TiN Metal Hardmask Etch Residue Removal on Advanced Porous Low-k and Cu Device with Corner Rounding Scheme
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Improved Cleaning Process for Etch Residue Removal in an Advanced Copper/Low-k Device without the Use of DMAC (Dimethylacetamide)
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Aqueous Fluoride Residue Removers for 32 nm and beyond Copper Ultra Low-κ Technologies
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Wet Clean Induce Pattern Collapse Mechanism Study
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HomeSolid State PhenomenaSolid State Phenomena Vol. 187Electrochemical, Physical, and Electrical...

Electrochemical, Physical, and Electrical Characterization of Two Clean Solutions for Cu PCMP Clean

Abstract:

Cu post-CMP clean is important to keep both Cu and low-k dielectric clean after polishing. In this paper, two Cu post-CMP clean solutions are analyzed in electrochemical, physical and electrical characterizations, based on the material and integration scheme of imec 65nm platform. It is shown that the combination of these two PCMP clean solutions can achieve both reasonable cleaning efficiencies and reliable low-k dielectric lifetime.

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Periodical:

Solid State Phenomena (Volume 187)

Pages:

235-239

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.187.235

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Online since:

April 2012

Authors:

Yun Long Li, Nancy Heylen, Jérôme Daviot, Chris Reid, Leonardus Leunissen

Keywords:

Cu CMP, Cu/Low-k Reliability, LPD Defects, PCMP Clean

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References

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