Photo Lithography - Surface Preparation Interactions

Philippe Garnier

doi:10.4028/www.scientific.net/SSP.219.177

Paper Titles

Particle Measurement with a Liquid-Borne Particle Counter: Analytical Figures of Merit
p.157

Fluid Flow and Defect Density Considerations when Drying Bumped Wafers Using Spin and Surface Tension Gradient Methods
p.161

Characterization of Cavitation in Ultrasonic or Megasonic Irradiated Gas Saturated Solutions Using a Hydrophone
p.165

Detection of HO₂•/O₂•^- Radicals Formed in Aqueous Solutions Irradiated with Megasonic Waves Using a Cavitation Threshold (CT) Cell Set-Up
p.170

Photo Lithography - Surface Preparation Interactions
p.177

Study of Etchants’ Diffusion into a 248 nm Deep UV Photoresist during a Wet Etch
p.183

Megasonic Enhanced Photoresist Strip with DiO₃
p.187

Wetting Behavior of Plasma Etch Residue Removal Solutions on Plasma Damaged and Repaired Porous ULK Dielectrics
p.193

Effect of Downstream Plasma Treatment on Dissolution of Fluorocarbon Polymer in Organic Solvents
p.197

HomeSolid State PhenomenaSolid State Phenomena Vol. 219Photo Lithography - Surface Preparation...

Photo Lithography - Surface Preparation Interactions

Abstract:

More than one third of process operations consist in surface preparations in the integrated circuits’ manufacturing. Most of them are directly or indirectly linked with photo lithography. This paper deals with these interactions.

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Periodical:

Solid State Phenomena (Volume 219)

Pages:

177-182

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.219.177

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Online since:

September 2014

Authors:

Philippe Garnier*

Keywords:

AFM, High Dose Implantation Resist Strip, Micro Masking, Photo Lithography, Photoresist Adhesion, Wafer Charging, Watermark

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