Megasonic Enhanced Photoresist Strip with DiO3

Don Dussault; Jens Fittkau; Christiane Gottschalk

doi:10.4028/www.scientific.net/SSP.219.187

Paper Titles

Characterization of Cavitation in Ultrasonic or Megasonic Irradiated Gas Saturated Solutions Using a Hydrophone
p.165

Detection of HO₂•/O₂•^- Radicals Formed in Aqueous Solutions Irradiated with Megasonic Waves Using a Cavitation Threshold (CT) Cell Set-Up
p.170

Photo Lithography - Surface Preparation Interactions
p.177

Study of Etchants’ Diffusion into a 248 nm Deep UV Photoresist during a Wet Etch
p.183

Megasonic Enhanced Photoresist Strip with DiO₃
p.187

Wetting Behavior of Plasma Etch Residue Removal Solutions on Plasma Damaged and Repaired Porous ULK Dielectrics
p.193

Effect of Downstream Plasma Treatment on Dissolution of Fluorocarbon Polymer in Organic Solvents
p.197

Post Etch Residue Removal and Material Compatibility in BEOL Using Formulated Chemistries
p.201

Characterization of Cu-BTA Organic Complexes on Cu during Cu CMP and Post Cu Cleaning
p.205

HomeSolid State PhenomenaSolid State Phenomena Vol. 219Megasonic Enhanced Photoresist Strip with DiO3

Megasonic Enhanced Photoresist Strip with DiO₃

Abstract:

Twenty years ago dissolved ozone in DIW (DiO₃) found its way into the semiconductor industry as a cleaning agent. DiO₃ provides an effective replacement for Piranha (H₂SO_4,H₂O₂) cleans. The fundamental chemistry of ozone based cleaning is due to direct and indirect reactions of ozone and oxygen radicals (the so-called radical pathway). Due to its high oxidation rate the radical pathway can accelerate the reaction. Megasonic energy can act as an initiator for the radical pathway. At the same time, due to the creation of turbulence inside the boundary layer, the available ozone close to the surface is increased. In the present study this chemical physical combination was tested for improvement of photoresist strip rate.

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Periodical:

Solid State Phenomena (Volume 219)

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187-190

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.219.187

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Online since:

September 2014

Authors:

Don Dussault*, Jens Fittkau, Christiane Gottschalk

Keywords:

Cavitation, DiO₃, Dissolved Ozone, Megasonic, Photoresist Stripping

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