Cost-of-Ownership Comparison of Single-Wafer Processes for Stripping Copper Pillar Bump Photomasks

Hong Seong Sohn; Tan Kuam Hua; Ding Liang; Steven Lee Hou Jang; Loh Woon Leng; Hua Mao Lin; John Tracy

doi:10.4028/www.scientific.net/SSP.219.225

Paper Titles

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Industrial Challenges of TiN Hard Mask Wet Removal Process for 14nm Technology Node
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TiN Metal Hardmask Residue Removal Formulation Development for Advanced Porous Low-K and Cu Interconnect Application
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Prevention of Unexpected Oxidation of Metal Layer by Removing Hydrogen Peroxide from Ultrapure Water and Diluted Hydrofluoric Acid
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Cost-of-Ownership Comparison of Single-Wafer Processes for Stripping Copper Pillar Bump Photomasks
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The Role of Mass Transfer in Removal of Cross-Linked Sacrificial Layers in 3DI Applications
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Scaling the 3D Bumps Pitch from 20 to 10 μm, Focusing on the Wet Cu Seed Etch Process Development
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Adhesion Improvement through Plasma Surface Treatments on Palladium Surface
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Control of HF Volatile Contamination in FOUP Environment by Advanced Polymers and Clean Gas Purge
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Cost-of-Ownership Comparison of Single-Wafer Processes for Stripping Copper Pillar Bump Photomasks

Abstract:

A new generation of negative tone and chemically amplified positive tone photoresists by TOK, JSR, Dow Chemical and others has gained momentum for advanced packaging applications. Resist thickness requirements are increasing to the 40-100 μm range as Cu pillars and micro-bumps are adopted, to accommodate the tighter pitches required in the newest multi-chip package designs. In order to form the pillars, the resist mask must be thicker than the height of the pillars to contain the entire bump structure.

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Periodical:

Solid State Phenomena (Volume 219)

Pages:

225-229

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.219.225

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Online since:

September 2014

Authors:

Hong Seong Sohn, Tan Kuam Hua, Ding Liang, Steven Lee Hou Jang, Loh Woon Leng, Hua Mao Lin, John Tracy*

Keywords:

Bumping Process, Chemically Amplified Photoresist, Copper Pillar, Cost-of-Ownership, Megasonics, Micro-Bump, Negative Tone Photoresist, Photoresist Stripping, Single-Wafer

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References

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