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HomeSolid State PhenomenaSolid State Phenomena Vol. 219Adhesion Improvement through Plasma Surface...

Adhesion Improvement through Plasma Surface Treatments on Palladium Surface

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Periodical:

Solid State Phenomena (Volume 219)

Pages:

241-244

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.219.241

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Online since:

September 2014

Authors:

Ivan Venegoni*, Matteo Consonni, Irene Bianchi, Enrica Ravizza, Salvatore Grasso, Simona Spadoni, Mario Pistoni, Paolo Colpani

Keywords:

Adhesion, Oxidation, Palladium, Passivation, Plasma, Reduction, Surface, Treatment

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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[1] M. Oezkoek, G. Ramos, D. Metzger, H. Roberts: Benefits of Pure Palladium for ENEP and ENEPIG Surface Finishing.

DOI: 10.1109/estc.2010.5642965

[2] W. Li, K. Reingruber, N. Mais, A. Acuesta, C. A. Yape: Plasma Cleaning on Bond Pad Surfaces for Gold Wire Bonding, Electronics Packaging Technology Conference, (2009).

DOI: 10.1109/eptc.2009.5416501