Modeling the Post-Implantation Annealing of Platinum

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Abstract:

Platinum in silicon is conveniently used for lifetime engineering in power devices. Its deep energy level ensures an efficient recombination of charge carriers while it is sufficiently far away from mid bandgap to be a low generation center. Contemporary development aims at replacing diffusion from platinum silicide by implantation. To obtain a better understanding of the mechanisms involved, a series of experiments has been performed in this work and interpreted by numerical simulation.

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Solid State Phenomena (Volume 242)

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258-263

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October 2015

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© 2016 Trans Tech Publications Ltd. All Rights Reserved

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[1] S. Coffa et al., Diffusion and lifetime engineering in silicon, Nuclear Instruments and Methods in Physics Research B 74 (1993) 47.

Google Scholar

[2] E. Badr, P. Pichler, and G. Schmidt, Modeling Platinum Diffusion in Silicon, J. Appl. Phys. 116 (2014) 133508.

DOI: 10.1063/1.4896909

Google Scholar

[3] H. -J. Schulze, Influence of D-defects in FZ material used for power devices and their impact on lifetime and leakage current, Electrochem. Soc. Proc. 96-13 (1996) 289-304.

Google Scholar

[4] E. Badr, P. Pichler and G. Schmidt: Deep Energy Levels of Platinum-Hydrogen Complexes in Silicon, Solid State Phenomena 205-206 (2014) 260-264.

DOI: 10.4028/www.scientific.net/ssp.205-206.260

Google Scholar

[5] F. C. Frank and D. Turnbull, Mechanism of diffusion of copper in germanium, Phys. Rev. 104(3) (1956) 617-618.

DOI: 10.1103/physrev.104.617

Google Scholar

[6] U. Gösele, W. Frank and A. Seeger, Mechanism and kinetics of the diffusion of gold in silicon, Appl. Phys. 23 (1980) 361-368.

DOI: 10.1007/bf00903217

Google Scholar

[7] C. J. Ortiz, et al., A physically based model for the spatial and temporal evolution of self-interstitial agglomerates in ion-implanted silicon, J. Appl. Phys. 96(9) (2004) 4866-4877.

DOI: 10.1063/1.1786678

Google Scholar

[8] M. Ullrich, A. Burenkov and H. Ryssel, Ion sputtering at grazing incidence for SIMS-analysis, Nuclear Instruments and Methods in Physics Research B, 228 (2005) 373-377.

DOI: 10.1016/j.nimb.2004.10.073

Google Scholar

[9] M. D. Giles, Transient phosphorus diffusion below the amorphization threshold, J. Electrochem. Soc. 138(4) (1991) 1160-1165.

DOI: 10.1149/1.2085734

Google Scholar

[10] C. Zechner et al., Accurate and efficient TCAD model for the formation and dissolution of small interstitial clusters and {311} defects in silicon, Materials Science and Engineering B 124-125 (2005) 401-403.

DOI: 10.1016/j.mseb.2005.08.010

Google Scholar

[11] N. Zographos, C. Zechner, and I. Avci, TCAD Model for the evolution of interstitial clusters, {311} defects, and dislocation loops in silicon, Mat. Res. Soc. Symp. Proc. 994 (2007) 0994-F10-01.

DOI: 10.1557/proc-0994-f10-01

Google Scholar

[12] N. Cowern et al., Energetics of Self-Interstitial Clusters in Si, Phys. Rev. Lett. 82(22) (1999) 4460-4463.

Google Scholar

[13] P. A. Stolk et al, Physical mechanisms of transient enhanced dopant diffusion in ion-implanted silicon, J. Appl. Phys. 81(9) (1997) 6031-6050.

Google Scholar