Study of TiW Conditioning through Different Wet and Dry Treatments to Promote Ni Electroless Growth

Ivan Venegoni; Fabio Scimè; Enrica Ravizza; Simona Spadoni; Francesco Pipia; Paolo Colpani; Mauro Alessandri

doi:10.4028/www.scientific.net/SSP.255.265

Paper Titles

High Throughput Wet Etch Solution for BEOL TiN Removal
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Impact of Dissolved Oxygen in Dilute HF Solution on Material Etch
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The Effect of Inhibitors on Co Corrosion in Alkaline Post Cu-CMP Cleaning Solutions
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Oxygen Control for Wet Clean Process on Single Wafer Platform
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Study of TiW Conditioning through Different Wet and Dry Treatments to Promote Ni Electroless Growth
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Post CMP Wet Cleaning Influence on Cu Hillocks
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Minimizing Wafer Surface Charging for Single-Wafer Wet Cleaning for 10 nm and beyond
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Silica Formation during Etching of Silicon Nitride in Phosphoric Acid
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Low Undercut Ti Etch Chemistry for Cu Bump Pillar under Bump Metallization Wet Etch Process
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HomeSolid State PhenomenaSolid State Phenomena Vol. 255Study of TiW Conditioning through Different Wet...

Study of TiW Conditioning through Different Wet and Dry Treatments to Promote Ni Electroless Growth

Abstract:

Electroless Ni deposition is often used in presence of Cu, Ti and Au. Recently TiW has also started to be employed, but with this alloy the Ni deposition is not always neat. In our work we investigate the effect of different wet treatments on the Ni growth by means of XPS analyses and SEM inspections. It is found that an oxidized surface inhibits the activator deposition. The de-oxidized Ti atoms in TiW on the other hand are believed to act as the principal sites for Pd seed deposition and subsequent Ni growth.

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Periodical:

Solid State Phenomena (Volume 255)

Pages:

265-269

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.255.265

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Online since:

September 2016

Authors:

Ivan Venegoni*, Fabio Scimè, Enrica Ravizza, Simona Spadoni, Francesco Pipia, Paolo Colpani, Mauro Alessandri

Keywords:

Dry Treatments, Electroless, Ni, Nickel, Oxidation, Ti, Titanium, TiW, Tungsten, W, Wet Treatment

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