Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy

Abstract:

The effect of bismuth (Bi) micro-alloying additions on wettability and mechanical properties of Sn-0.7Cu lead-free solder were explored. This paper also investigates the influences of various Bi percentages on the suppression of intermetallic compound formation. Scanning electron microscope (SEM) was used to observe the microstructure evolution of solder joint including the thickness of interfacial intermetallic layers. Overall, with the addition of Bi to Sn-0.7Cu solder, the size of primary Cu₆Sn₅ become smaller and suppresses the thickness of interfacial intermetallic compound between solder and the Cu substrate. Microhardness value and wetting properties also increased with Bi addition which resulted in smaller size of β-Sn and Cu₆Sn₅.

• Periodical: Solid State Phenomena (Volume 273)
• Pages: 27-33
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.273.27
• Online since: April 2018
• Authors: Mohd Izrul Izwan Ramli, M.S.S. Yusof, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Kazuhiro Nogita
• Keywords: Bismuth, Intermetallic, Lead-Free Solder, Wettability

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