Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder

Quy Tran Xuan; Mohd Arif Anuar Mohd Salleh; Stuart D. McDonald; Kazuhiro Nogita

doi:10.4028/www.scientific.net/SSP.273.9

Paper Titles

The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates
p.3

Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder
p.9

Formation of Cu₆Sn₅/(Cu, Ni)₆Sn₅ Intermetallic Compounds between Cu₃Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding
p.14

Grain Refinements of Cu₆Sn₅ in Sn-3wt%Ag-5wt%Cu High Temperature Solder Alloys
p.20

Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy
p.27

Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review
p.34

Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review
p.40

Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution
p.46

HomeSolid State PhenomenaSolid State Phenomena Vol. 273Effect of Trace Phosphorus on the Dross Formation...

Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder

Abstract:

Additions of trace elements such as Phosphorus (P) and Germanium (Ge) are common practice to improve the oxidation resistance in Tin-Copper (Sn-Cu) wave solder systems, however, little insights are available regarding their combined role. In this article, the effect of trace P (<100ppm), in the presence of Ge (<100ppm), on the phase composition and microstructure of Sn-Cu-Ni wave solder dross is studied using various techniques including Synchrotron XRPD, SEM, FIB and TEM. We find that P additions, in the presence of Ge, result in the formations of SnO, SnO₂ and Ni₂SnP intermetallic in the dross whereas only SnO is present in the P-free equivalent. The crystal structure of Ni₂SnP is identified as orthorhombic with the space group Pnma. Based on the findings, it is evident that P not only influences the oxidation state of tin oxides but also reduces the concentration of effective Ni in the alloys via the formation of Ni₂SnP intermetallic.

You might also be interested in these eBooks

Electronic Packaging Interconnect Technology

View Preview

Info:

Periodical:

Solid State Phenomena (Volume 273)

Pages:

9-13

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.273.9

Citation:

Cite this paper

Online since:

April 2018

Authors:

Quy Tran Xuan, Mohd Arif Anuar Mohd Salleh, Stuart D. McDonald, Kazuhiro Nogita

Keywords:

Dross, Fluidity, Intermetallics, Ni₂SnP, Tin Oxides, Wave Solder

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] T. Nishimura, US Patent No. US6180055, (2001).

Google Scholar

[2] K. Nogita, T. Nishimura: Scripta Materialia, Vol. 59 (2008) pp.191-194.

Google Scholar

[3] K. Nogita, C.M. Gourlay, T. Nishimura: JOM, 61 (2009) pp.45-51.

Google Scholar

[4] C.M. Gourlay, J. Read, K. Nogita, A.K. Dahle, J. Electron. Mater., 37 (2008) pp.51-60.

Google Scholar

[5] K. Nogita, H. Yasuda, C.M. Gourlay, S. Suenaga, H. Tsukamoto, S.D. McDonald, A. Takeuchi, K. Uesugi, Y. Suzuki: Transactions of The Japan Institute of Electronics Packaging, 3 (2010) pp.40-46.

DOI: 10.5104/jiepeng.3.40

Google Scholar

[6] K. Nogita, M. A. A. M. Salleh, X. Q. Tran, J. Read, S. Smith, S. D. McDonald: Materials Science Forum, Vol. 857 (2016), pp.49-52.

Google Scholar

[7] K. Nogita, C.M. Gourlay, J. Read, T. Nishimura, S. Suenaga, A.K. Dahle: Materials Transactions, 49 (2008) 443-448.

DOI: 10.2320/matertrans.mbw200713

Google Scholar

[8] K. Sweatman, T. Nishimura,T. Fukami: Proceedings of SMTA International (2015) pp.314-320.

Google Scholar

[9] S. Furuseth and H. Fjellvåg: Acta chemica Scandinavica, Vol. 39a (1985), pp.537-544.

DOI: 10.3891/acta.chem.scand.39a-0537

Google Scholar

[10] V. Keimes, H.M. Blume, A. Mewis: Zeitschrift fuer Anorganische und Allgemeine Chemie,Vol. 625 (1999) pp.207-210.

DOI: 10.1002/(sici)1521-3749(199902)625:2<207::aid-zaac207>3.0.co;2-i

Google Scholar

[11] F.J. Garcia-Garcia, A.K. Larsson, S. Furuseth: Journal of Solid State Chemistry, Vol.166 (2002) pp.352-361.

Google Scholar

[12] S. Furuseth and H. Fjellvåg: Acta chemica Scandinavica, Vol. 48 (1994) pp.134-138.

Google Scholar

[13] C. Schmetterer, M. Wildner, G. Giester, K.W. Richter, H. Ipser: Zeitschrift fuer Anorganische und Allgemeine Chemie, Vol. 2 (2009) pp.301-306.

DOI: 10.1002/zaac.200800409

Google Scholar

[14] F.J. Garcia-Garcia, A.K. Larsson, S. Furuseth: Solid State Sciences, Vol. 5 (2003) pp.205-217.

Google Scholar