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Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review

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Abstract:

Since the implementation of RoHS in avoidance to useof lead in electronic packaging, the development of lead-free solder has become priority. However, some of the potential candidates for lead-free solder have weaknesses such as slightly higher of melting point, excessive of intermetallic growth (IMC) and uncertainty service reliability that need to overcome. One of the common methods used to improve the characteristic and properties of the lead-free solder is by the addition of another alloying element. One of the promising alloying elements is bismuth (Bi). A few researchers have found out that Bi has a capability to improve the microstructure, reduce the melting temperature and controlled the IMC growth, yet, its advantageous is believed have not been thoroughly explored. Influence of (Bi) in lead-free solder alloys give interest to be studied and understand from different perspective due to its capability to improve the wettability and solder spread, and also reduce the melting temperatures of the solder. In this paper, a review on influence of Bi inSn-based lead-free solder and its advantageous were discussed.

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Periodical:

Solid State Phenomena (Volume 273)

Pages:

40-45

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.273.40

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Online since:

April 2018

Authors:

Nurul Razliana Abdul Razak, Mohd Arif Anuar Mohd Salleh, Norainiza Saud, Rita Mohd Said, Mohd Izrul Izwan Ramli

Keywords:

Bismuth, Intermetallic Compound, Melting Temperature, Microstructure, Sn-Based Lead-Free Solder

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© 2018 Trans Tech Publications Ltd. All Rights Reserved

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