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HomeSolid State PhenomenaSolid State Phenomena Vol. 273Solidification Behavior of Sn Cu Based Peritectic...

Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review

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Abstract:

Microstructure evolution that exhibit from the reaction of Sn Cu pritectic alloys become an interesting phenomenon that need to be explored since the properties of the alloys depend on their microstructures. Due to less understanding on the solidification behavior on peritectic alloys, extensive research are made on this type of alloys to gain more information regarding on the microstructure formation. This paper reviews the mechanisms on peritectic solidification on Sn Cu based peritectic alloys. The changed in peritectic microstructure due to external source such as direct current (DC) field, ultrasonic field and isothermal time are discuss respectively through this paper. The focus is made on peritectic solidification of Sn Cu based alloy since it has a promising potential for high temperature lead-free solder application.

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Periodical:

Solid State Phenomena (Volume 273)

Pages:

34-39

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.273.34

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Online since:

April 2018

Authors:

Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, Norainiza Saud, Mohd Izrul Izwan Ramli, Andrei Victor Sandu

Keywords:

Microstructure, Peritectic Reaction, Sn Cu Peritectic Alloys

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© 2018 Trans Tech Publications Ltd. All Rights Reserved

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