For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Preface
The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates
p.3
Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder
p.9
Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding
p.14
Grain Refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu High Temperature Solder Alloys
p.20
Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy
p.27
Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review
p.34
Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review
p.40
Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution
p.46

Preface

Article Preview

Abstract:

By email View Pdf
You might also be interested in these eBooks
Electronic Packaging Interconnect Technology View Preview

Info:

Periodical:

Solid State Phenomena (Volume 273)

Online since:

April 2018

Сopyright:

© 2018 Trans Tech Publications Ltd. All Rights Reserved

Share:

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.