Preface
The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates
p.3
p.3
Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder
p.9
p.9
Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding
p.14
p.14
Grain Refinements of Cu6Sn5 in Sn-3wt%Ag-5wt%Cu High Temperature Solder Alloys
p.20
p.20
Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy
p.27
p.27
Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review
p.34
p.34
Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review
p.40
p.40
Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution
p.46
p.46
Preface
Abstract:
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Info:
Periodical:
Solid State Phenomena (Volume 273)
Online since:
April 2018
Сopyright:
© 2018 Trans Tech Publications Ltd. All Rights Reserved
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