The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates

Shi Qian Liu; Dong Dong Qu; Stuart D. McDonald; Kazuhiro Nogita

doi:10.4028/www.scientific.net/SSP.273.3

Paper Titles

The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates
p.3

Effect of Trace Phosphorus on the Dross Formation in Tin-Copper-Nickel Wave Solder
p.9

Formation of Cu₆Sn₅/(Cu, Ni)₆Sn₅ Intermetallic Compounds between Cu₃Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding
p.14

Grain Refinements of Cu₆Sn₅ in Sn-3wt%Ag-5wt%Cu High Temperature Solder Alloys
p.20

Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy
p.27

Solidification Behavior of Sn Cu Based Peritectic Alloys: A Short Review
p.34

Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review
p.40

Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution
p.46

HomeSolid State PhenomenaSolid State Phenomena Vol. 273The Interaction of Sn-Ga Alloys and Au Coated Cu...

The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates

Abstract:

Ga and Ga-based alloys appear to be promising materials for low temperature soldering in microelectronics. This research involved an analysis of the joint interfaces that resulted from reactions between a eutectic Ga-Sn alloy and Au coated Cu substrates at both room temperature and 100°C. At both temperatures the intermetallic CuGa₂ accounted for the majority of the interfacial microstructure. This study has shown the possibility of using eutectic Ga-Sn alloys in low temperature soldering applications, as well as the advantages of Synchrotron XFM techniques in characterising trace element distributions in solder joints.

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Solid State Phenomena (Volume 273)

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3-8

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https://doi.org/10.4028/www.scientific.net/SSP.273.3

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April 2018

Authors:

Shi Qian Liu, Dong Dong Qu, Stuart D. McDonald, Kazuhiro Nogita

Keywords:

Gallium, Intermetallic, Low Temperature Solder, X-Ray Fluorescence Microanalysis

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