Paper Titles

Effect of Al Additions on Corrosion Performance of Sn-9Zn Solder in Acidic Solution
p.46

Corrosion of Sn-Zn-Bi Lead Free Solder in KOH Electrolyte
p.51

Corrosion Performance of Sn-9Zn and Sn-0.7Cuin 3.5% NaCl Solution
p.56

Effect of Phosphorus and Nickel on Electrochemical Migration of Sn-3Ag-0.7Cu Solder Paste in Simulated Body Fluid
p.61

Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification
p.66

Tensile Properties of Sn-Bi Lead-Free Solder Alloys
p.72

Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface
p.77

Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens
p.83

Microstructure and Phase Analyses on the Corrosion of SAC305 Solder in NaСl Solution
p.91

HomeSolid State PhenomenaSolid State Phenomena Vol. 273Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder...

Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification

Article Preview

Abstract:

Sn-0.7Cu-0.05Ni is a widely used Pb-free solder that solidifies into a near-eutectic microstructure and a small fraction of primary Cu₆Sn₅. This paper overviews in-situ time-resolved imaging experiments on the solidification of Sn-0.7Cu-0.05Ni solder under three conditions: (i) directional solidification, (ii) continuous cooling in a near-uniform thermal field, and (iii) solder joint solidification on a Cu substrate. Primary Cu₆Sn₅ grow as rods along [0001] in each case but can also grow as X-shaped crystals in (iii). There are significant differences in eutectic growth due to nucleation difficulties for tin in conditions (ii) and (iii).

You might also be interested in these eBooks

Electronic Packaging Interconnect Technology

Info:

Periodical:

Solid State Phenomena (Volume 273)

Pages:

66-71

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.273.66

Citation:

Cite this paper

Online since:

April 2018

Authors:

J.W. Xian*, Mohd Arif Anuar Mohd Salleh, G. Zeng, S.A. Belyakov, Hideyuki Yasuda, Kazuhiro Nogita, Christopher M. Gourlay

Keywords:

Crystal Growth, Cu₆Sn₅, Eutectic, Intermetallics, Nucleation, Pb-Free Soldering

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2018 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] Schueller R, Blattau N, Arnold J, Hillman C. SMTA Journal 2010;23:18-26.

[2] Gourlay CM, Read J, Nogita K, Dahle AK. J. Electron. Mater. 2008;37 51-60.

[3] Tsukamoto H, Nishimura T, Suenaga S, McDonald SD, Sweatman KW, Nogita K. Microelectron. Reliab. 2011;51:657-67.

[4] Nogita K, Nishimura T. Scripta Mater 2008;59:191-4.

[5] Yang C, Song F, Lee SR. Microelectron. Reliab. 2014;54:435-46.

[6] Ventura T, Gourlay CM, Nogita K, Dahle AK. J. Electron. Mater. 2008;37:32-9.

[7] Silva BL, Cheung N, Garcia A, Spinelli JE. J. Electron. Mater. 2013;42:179-91.

[8] Hammad AE. Materials & Design 2013;52:663-70.

[9] Gyenes A, Simon A, Lanszki P, Gácsi Z. Archives of Metallurgy & Materials 2015;60:1449-54.

[10] Vuorinen V, Yu H, Laurila T, Kivilahti JK. J. Electron. Mater. 2008;37:792-805.

[11] Gourlay CM, Nogita K, Read J, Dahle AK. J. Electron. Mater. 2010;39:56-69.

[12] Gourlay CM, Nogita K, Dahle AK, Yamamoto Y, Uesugi K, Nagira T, et al. Acta Mater. 2011;59:4043-54.

DOI: 10.1016/j.actamat.2011.03.028

[13] Gourlay CM, Belyakov SA, Ma ZL, Xian JW. JOM 2015;67:2383-93.

[14] Mohd Salleh MAA, Gourlay CM, Xian JW, Belyakov SA, Yasuda H, McDonald SD, Nogita K. Scientific reports. 2017;7:40010.

[15] Wang TM, Zhou P, Cao F, Kang HJ, Chen ZN, Fu YN, et al. Intermetallics 2015;58:84-90.

[16] Ventura T, Terzi S, Rappaz M, Dahle AK. Acta Mater. 2011;59:4197-206.

[17] Kurz W, Fisher DJ. International Metals Reviews 1979;24:177-204.

[18] Xian JW, Belyakov SA, Britton TB, Gourlay CM. J. Alloy Compd 2015;619:345-55.

[19] Xian JW, Belyakov SA, Ollivier M, Nogita K, Yasuda H, Gourlay CM. Acta Materialia. 2017;126:540-51.

DOI: 10.1016/j.actamat.2016.12.043