Tensile Properties of Sn-Bi Lead-Free Solder Alloys

Abstract:

The Influence of alloy composition on tensile properties of Sn-Bi, Sn-Bi-Cu and Sn-Bi-Ni lead-free solder alloys were investigated. It is found that the elongation of Sn-Bi alloys depend on Bi content, and Sn-40wt% Bi alloy has the highest elongation. The addition of Cu and Ni improves the ductility of Sn 35-45wt% Bi alloys. The fine microstructure of Sn-Bi-Cu or Ni alloys have an effect on the ductility of Sn-Bi based alloys. The elongation increases with decreasing strain rate and increasing temperature. Cu and Ni added to Sn-Bi alloy showed the super plasticity behavior at low strain rate and high temperature (more than 333 K). Moreover, strain rate sensitivity ‘m’ increases with temperature.

• Periodical: Solid State Phenomena (Volume 273)
• Pages: 72-76
• DOI: https://doi.org/10.4028/www.scientific.net/SSP.273.72
• Online since: April 2018
• Authors: Akira Yamauchi*, Kenta Ida, Masahito Fukuda, Takuma Yamaguchi
• Keywords: Lead-Free Solder, Sn-Bi-Cu, Sn-Bi-Ni, Solidification, Tensile Properties

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