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HomeSolid State PhenomenaSolid State Phenomena Vol. 273Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys...

Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens

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Abstract:

Tensile properties of Sn-5Sb (mass%) and Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge (mass%) were investigated using miniature size specimens and obtained results were compared. Tensile strength of both alloys increase with increasing the strain rate and decrease with increasing the temperature. Although similar dependency to the temperature is observed in 0.1% proof stress, the effect of the strain rate on it is obscure. The tensile strength and the 0.1% proof stress of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge are higher than those of Sn-5Sb. The elongation of Sn-5Sb is relatively stable at the range from 0.4 to 0.6. The elongation of Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge which is approximately 0.3, is inferior to that of Sn-5Sb. On the basis of investigation of stress exponent, n, it was clarified that dispersion strengthening by Ag₃Sn particulates in Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge is effective to prevent the degradation of creep resistance compared with Sn-5Sb that is strengthened by solid-solution of Sb in β-Sn phases and dispersion of SbSn compounds.

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Periodical:

Solid State Phenomena (Volume 273)

Pages:

83-90

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.273.83

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Online since:

April 2018

Authors:

Tatsuya Kobayashi, Masaki Yokoi, Kyosuke Kobayashi, Kohei Mitsui, Ikuo Shohji*

Keywords:

Lead-Free Solder, Miniature Size Specimen, Sn-3.5Ag-0.5Cu-0.07Ni-0.01Ge, Sn-5Sb, Tensile Properties

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© 2018 Trans Tech Publications Ltd. All Rights Reserved

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* - Corresponding Author

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