Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface

Omid Mokhtari; Hiroshi Nishikawa

doi:10.4028/www.scientific.net/SSP.273.77

Paper Titles

Corrosion Performance of Sn-9Zn and Sn-0.7Cuin 3.5% NaCl Solution
p.56

Effect of Phosphorus and Nickel on Electrochemical Migration of Sn-3Ag-0.7Cu Solder Paste in Simulated Body Fluid
p.61

Synchrotron Radiography of Sn-0.7Cu-0.05Ni Solder Solidification
p.66

Tensile Properties of Sn-Bi Lead-Free Solder Alloys
p.72

Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface
p.77

Comparison of Sn-Sb and Sn-Ag-Cu-Ni-Ge Alloys Using Tensile Properties of Miniature Size Specimens
p.83

Microstructure and Phase Analyses on the Corrosion of SAC305 Solder in NaСl Solution
p.91

STEM Analysis of Atom Location in (Cu, Au, Ni)₆Sn₅ Intermetallic Compounds
p.95

Effect of Trace Elements on the Liquid Structure of Sn-Cu Alloys Investigated by High Energy X-Ray Diffraction
p.101

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Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface

Abstract:

While various mechanical properties of SnAgCu (SAC) solder has been reported in the literature the corrosion resistance of solder materials has not been widely reported. This study shows regions adjacent to the Cu₆Sn₅ intermetallic compounds (IMCs) as the corroded region. To investigate the possible formation of a galvanic cell at the interface of SAC solder and the Cu substrate the surface potential distribution at this interface has been evaluated. Results exhibited a comparatively large surface potential difference between SAC solder and the Cu₆Sn₅ IMC indicating SAC solder and Cu₆Sn₅ IMC as the anode and cathode in this system, respectively.

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Solid State Phenomena (Volume 273)

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77-82

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https://doi.org/10.4028/www.scientific.net/SSP.273.77

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Online since:

April 2018

Authors:

Omid Mokhtari, Hiroshi Nishikawa

Keywords:

Atomic Force Microscopy, Corrosion, Lead-Free Solder, Microelectronics Packaging, Surface Potential Difference

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