Suppression of In-Grown SF Formation and BPD Propagation in 4H-Sic Epitaxial Layer by Sublimating Sub-Surface Damage before the Growth

Article Preview

Abstract:

It is known that basal plane dislocations (BPDs) and in-grown stacking faults (IGSFs) in the 4H-SiC epitaxial layer cause severe electrical degradation in SiC devices. The impact that sub-surface damage (SSD) on a production-grade 4H-SiC substrate with CMP-finished surface causes on both the BPD propagation and IGSF formation during epitaxial growth was investigated by Dynamic AGE-ing🄬 (DA). The substrates etched by DA sublimation etching to adjust the residual amount of SSD maintaining a smooth surface without macro step bunching were grown to observe BPD and IGSF density. The obtained results showed that these defect densities decreased exponentially with increasing etching depth. We demonstrated SSD introduced by mechanical processing led BPDs and IGSFs to extend or introduce to the epitaxial layer.

You might also be interested in these eBooks

Info:

* - Corresponding Author

[1] H. Fujiwara, T. Kimoto, T. Tojo, and H. Matsunami, Characterization of in-grown stacking faults in 4H-SiC (0001) epitaxial layers and its impacts on high-voltage Schottky barrier diodes, Appl. Phys. Lett., 87 (2005) 051912.

DOI: 10.1063/1.1997277

Google Scholar

[2] H. Matsunami, and T. Kimoto, Step-controlled epitaxial growth of SiC: high quality homoepitaxy, Mater. Sci. Eng. R Rep., 20 (1997) 125-166.

DOI: 10.1016/s0927-796x(97)00005-3

Google Scholar

[3] T. Höchbauer, C. Heidorn, and N. Tsavdaris, New SiC Epitaxial Growth Process with Up to 100% BPD to TED Defect Conversion on 150mm Hot-Wall CVD reactor, Mater. Sci. Forum, 963 (2019) 123-126.

DOI: 10.4028/www.scientific.net/msf.963.123

Google Scholar

[4] N. Zhang, Y. Chen, E. K. Sanchez, D. R. Black, and M. Dudley, The Effect of 4H-SiC Substrate Surface Scratches on Chemical Vapor Deposition Grown Homo-Epitaxial Layer Quality, Mater. Sci. Forum, 615 (2009) 109-112.

DOI: 10.4028/www.scientific.net/msf.615-617.109

Google Scholar

[5] M. Sasaki, H. Matsuhata, K. Tamura, K. Sako, K. Kojima, H. Yamaguchi, and M. Kitabatake, Synchrotron X-ray topography analysis of local damage occurring during polishing of 4H-SiC wafers, Jpn. J. Appl. Phys., 54 (2015) 091301.

DOI: 10.7567/jjap.54.091301

Google Scholar

[6] K. Ashida, D. Dojima, Y. Kutsuma, S. Torimi, S. Nogami, Y. Imai, S. Kimura, J. Mizuki, N. Ohtani, and T. Kaneko, Evaluation of Polishing-Induced Subsurface Damage of 4H-SiC (0001) by Cross-Sectional Electron Backscattered Diffraction and Synchrotron X-Ray Micro-Diffraction, MRS Adv., 1 (2016) 3697-3702.

DOI: 10.1557/adv.2016.433

Google Scholar

[7] K. Ashida, D. Dojima, S. Torimi, N. Yabuki, Y. Sudo, T. Sakaguchi, S. Nogami, M. Kitabatake, and T. Kaneko, Rearrangement of Surface of 4°Off-Axis 4H-SiC (0001) Epitaxial Wafer by High Temperature Annealing in Si/Ar Ambient, Mater. Sci. Forum, 924 (2018) 249-252.

DOI: 10.4028/www.scientific.net/msf.924.249

Google Scholar

[8] Kwansei Gakuin University, Toyota Tsusyo Corporation. (March 1, 2021). Kwansei Gakuin University and Toyota Tsusyo Develop Innovative Process that Achieves "Zero Defects" in 6-Inch SiC Substrates – Supply of Samples to Device Manufacturers to Begin to Facilitate Early Mass Production [Press release]. https://global.kwansei.ac.jp/cms/kwansei_en/researchspotlight/202110 20_プレスリリース英文02.pdf

DOI: 10.46679/978819484836310

Google Scholar