Paper Titles

Metal Wet Cleaning with No Corrosion: A Novel Approach
p.35

Non-Contact Post Cu CMP Cleaning Using Megasonic Energy
p.39

Improved Phosphoric Acid Mixtures for Nitride Strip
p.43

Silicon Wafer Cleaning Processes Monitoring by the Surface Charge Profiler Method
p.47

New Aqueous Clean for Aluminum Interconnects: Part II. Applications
p.51

Synchronous Schlieren Image Analysis of Megasonic Single Wafer Cleaning
p.55

Dry Cleaning of Organic Contamination on Silicon Wafers Using Rapid Optical Surface Treatment
p.59

Materials Compatibility and Organic Build-Up during Ozone-Based Cleaning of Semiconductor Devices
p.63

Surface Characterization after Different Wet Chemical Cleans
p.67

HomeSolid State PhenomenaSolid State Phenomena Vols. 76-77New Aqueous Clean for Aluminum Interconnects: Part...

New Aqueous Clean for Aluminum Interconnects: Part II. Applications

Article Preview

Abstract:

You might also be interested in these eBooks

Ultra Clean Processing of Silicon Surfaces V

Info:

Periodical:

Solid State Phenomena (Volumes 76-77)

Pages:

51-54

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.76-77.51

Citation:

Cite this paper

Online since:

January 2001

Authors:

R. Ravikumar, D.L. Rath, D.J. Delehanty, R.G. Filippi, E.W. Kiewra, G. Stojakovic, K.J. McCullough, D.D. Miura, J. Gambino, F. Schnabel, B.N. Rhoads

Keywords:

Post Al RIE Clean, Reliability, Via Clean

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2001 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation: