New Aqueous Clean for Aluminum Interconnects: Part I. Fundamentals
p.31
p.31
Metal Wet Cleaning with No Corrosion: A Novel Approach
p.35
p.35
Non-Contact Post Cu CMP Cleaning Using Megasonic Energy
p.39
p.39
Improved Phosphoric Acid Mixtures for Nitride Strip
p.43
p.43
Silicon Wafer Cleaning Processes Monitoring by the Surface Charge Profiler Method
p.47
p.47
New Aqueous Clean for Aluminum Interconnects: Part II. Applications
p.51
p.51
Synchronous Schlieren Image Analysis of Megasonic Single Wafer Cleaning
p.55
p.55
Dry Cleaning of Organic Contamination on Silicon Wafers Using Rapid Optical Surface Treatment
p.59
p.59
Materials Compatibility and Organic Build-Up during Ozone-Based Cleaning of Semiconductor Devices
p.63
p.63
Silicon Wafer Cleaning Processes Monitoring by the Surface Charge Profiler Method
Abstract:
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Info:
Periodical:
Solid State Phenomena (Volumes 76-77)
Pages:
47-50
Citation:
Online since:
January 2001
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© 2001 Trans Tech Publications Ltd. All Rights Reserved
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