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HomeSolid State PhenomenaSolid State Phenomena Vols. 76-77Non-Contact Post Cu CMP Cleaning Using Megasonic...

Non-Contact Post Cu CMP Cleaning Using Megasonic Energy

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Abstract:

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Ultra Clean Processing of Silicon Surfaces V

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Periodical:

Solid State Phenomena (Volumes 76-77)

Pages:

39-42

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.76-77.39

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Online since:

January 2001

Authors:

Wim Fyen, Jeffrey M. Lauerhaas, Ingrid Vos, Marc Meuris, Paul W. Mertens, Marc Heyns

Keywords:

Cu, Megasonics, Post Cu CMP Cleaning

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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