Non-Contact Post Cu CMP Cleaning Using Megasonic Energy

Abstract:

Article Preview

Info:

Periodical:

Solid State Phenomena (Volumes 76-77)

Edited by:

Marc Heyns, Marc Meuris and Paul Mertens

Pages:

39-42

DOI:

10.4028/www.scientific.net/SSP.76-77.39

Citation:

W. Fyen et al., "Non-Contact Post Cu CMP Cleaning Using Megasonic Energy", Solid State Phenomena, Vols. 76-77, pp. 39-42, 2001

Online since:

January 2001

Export:

Price:

$35.00

In order to see related information, you need to Login.