Solid State Phenomena Vols. 76-77

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https://doi.org/10.4028/www.scientific.net/SSP.76-77

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Table of Contents

Paper Title Page

Preface, Conference Organisation and Sponsors

Defects and Contamination in Microelectronic Device Production: State-of-the-Art and Prospects

Authors: Bernd O. Kolbesen, Hans Cerva, G. Zoth

The Effect of Ion Implantation on the Metal Contamination of Silicon Surfaces in Aqueous Solution

Authors: Lee M. Loewenstein, Paul W. Mertens, Marc Heyns

Barium, Strontium and Bismuth Contamination in CMOS Processes

Authors: H. Boubekeur, T. Mikolajick, J. Höpfner, C. Dehm, W. Pamler, J. Steiner, G. Kilian, Bernd O. Kolbesen, Anton J. Bauer, Lothar Frey, Heiner Ryssel

An Exploration on the Bridge Formation Mechanism of Cylindrical Storage Poly-Silicon by Water Marks in High Performance 4Gigabit DRAM Capacitor

Authors: Kuntack Lee, Woo Gwan Shim, Hyung Ho Ko, Ho Young Kim, Yong Pil Han, Sang Rok Hah, Joo Tae Moon

Chemical Processing and Materials Compatibility of High-K Dielectric Materials for Advanced Gate Stacks

Authors: J.J. Guan, Glenn W. Gale, G. Bersuker, M. Jackson, Howard R. Huff

Wettability Modification of Polysilicon for Stiction Reduction in Silicon Based Micro-electromechanical Structures

Authors: Angeles Marcia Almanza-Workman, Srini Raghavan, Pierre Deymier, David J. Monk, Ray Roop

Dual Gate Oxide for 0.18μm Technologies and Below: Optimization of the Wet Processing Sequence

Authors: Didier Lévy, Sébastien Petitdidier, H. Bernard, F. Guyader, C. Dezauzier, C. Pizzetti

New Aqueous Clean for Aluminum Interconnects: Part I. Fundamentals

Authors: D.L. Rath, R. Ravikumar, D.J. Delehanty, R.G. Filippi, E.W. Kiewra, G. Stojakovic, K.J. McCullough, D.D. Miura, B.N. Rhoads

Metal Wet Cleaning with No Corrosion: A Novel Approach

Authors: Francesco Pipia, Geun Min Choi, Tadahiro Ohmi