Solid State Phenomena Vols. 76-77

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.76-77

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Non-Contact Post Cu CMP Cleaning Using Megasonic Energy

Authors: Wim Fyen, Jeffrey M. Lauerhaas, Ingrid Vos, Marc Meuris, Paul W. Mertens, Marc Heyns

Improved Phosphoric Acid Mixtures for Nitride Strip

Authors: Rita Vos, Marcel Lux, Thierry Conard, H. De Witte, Paul W. Mertens, Marc Heyns, Z. Hatcher

Silicon Wafer Cleaning Processes Monitoring by the Surface Charge Profiler Method

Authors: Adrien Danel, Pascal Besson, T. Lardin, F. Tardif

New Aqueous Clean for Aluminum Interconnects: Part II. Applications

Authors: R. Ravikumar, D.L. Rath, D.J. Delehanty, R.G. Filippi, E.W. Kiewra, G. Stojakovic, K.J. McCullough, D.D. Miura, J. Gambino, F. Schnabel, B.N. Rhoads

Synchronous Schlieren Image Analysis of Megasonic Single Wafer Cleaning

Authors: Takashi Azuma, Akihiro Tomozawa, Hideo Kinoshita, Shin-ichiro Umemura

Dry Cleaning of Organic Contamination on Silicon Wafers Using Rapid Optical Surface Treatment

Authors: Adrien Danel, Névine Rochat, M. Olivier, A. Roche, F. Tardif

Materials Compatibility and Organic Build-Up during Ozone-Based Cleaning of Semiconductor Devices

Authors: F. De Smedt, Stefan De Gendt, Marc Heyns, Chris Vinckier

Surface Characterization after Different Wet Chemical Cleans

Authors: Martine Claes, Erika Röhr, Thierry Conard, F. De Smedt, Stefan De Gendt, W. Storm, T. Bauer, Paul W. Mertens, Marc Heyns

A Hydrogenated Water Application to Semiconductor Manufacturing

Authors: Ikunori Yokoi, Geun Min Choi, Yoshio Yamazaki, Tadahiro Ohmi

Investigation of Trace Metals Analyses of Dry Residue on Silicon Wafer Surfaces by TXRF and ICP-MS

Authors: Jiang Bo Wang, M. Balazs, Piero Pianetta, K. Baur, S. Brennan