Volumes

Solid State Phenomena
Vol. 88

Solid State Phenomena
Vol. 87

Solid State Phenomena
Vols. 85-86

Solid State Phenomena
Vols. 82-84

Solid State Phenomena
Vols. 80-81

Solid State Phenomena
Vols. 78-79

Solid State Phenomena
Vols. 76-77

Solid State Phenomena
Vols. 73-75

Solid State Phenomena
Vol. 72

Solid State Phenomena
Vol. 71

Solid State Phenomena
Vols. 69-70

Solid State Phenomena
Vols. 67-68

Solid State Phenomena
Vols. 65-66

HomeSolid State PhenomenaSolid State Phenomena Vols. 76-77

Solid State Phenomena Vols. 76-77

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.76-77

Export:

ToC:

Table of Contents

<<
<
…
4
5
6
7
8

Paper Title Page

SC-1 Clean Improvements for Post STI CMP

Authors: Kenneth McAvey, Andrew Hoadley, Chad Binkerd

291

Contamination and Cleaning of Oxide Areas Exposed During Copper CMP in Hydroxylamine Based Slurries

Authors: C. Shang, Wayne Huang, Srini Raghavan, Zhe Fei Chen, Robert Small, M. Peterson, Jeong Sic Jeon

295

Post Copper CMP: a Two Steps Cleaning Recipe

Authors: Alessio Beverina, J.M. Fabbri, Didier Lévy, F. Tardif, Pascal Besson

299

Silicon Surface Cleaning after Spacer Dry Etching

Authors: Denis Shamiryan, Mikhail R. Baklanov, Serge Vanhaelemeersch

303

The Effect of DI Water and Intermediate Rinse Solutions on Post Metal Etch Residue Removal Using Semi-Aqueous Cleaning Chemistries

Authors: Simon J. Kirk, Robert Small

307

Wet Cleaning of Trenches and Vias after Oxide/Nitride Dry Etch with Cu Exposed

Authors: Steven Verhaverbeke, Jason Chi-Hao Shao, Lewis Liu

311

<<
<
…
4
5
6
7
8