Contamination and Cleaning of Oxide Areas Exposed During Copper CMP in Hydroxylamine Based Slurries

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Periodical:

Solid State Phenomena (Volumes 76-77)

Edited by:

Marc Heyns, Marc Meuris and Paul Mertens

Pages:

295-298

DOI:

10.4028/www.scientific.net/SSP.76-77.295

Citation:

C. Shang et al., "Contamination and Cleaning of Oxide Areas Exposed During Copper CMP in Hydroxylamine Based Slurries", Solid State Phenomena, Vols. 76-77, pp. 295-298, 2001

Online since:

January 2001

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$35.00

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