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Silicon Surface Cleaning after Spacer Dry Etching
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HomeSolid State PhenomenaSolid State Phenomena Vols. 76-77Wet Cleaning of Trenches and Vias after...

Wet Cleaning of Trenches and Vias after Oxide/Nitride Dry Etch with Cu Exposed

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Abstract:

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Ultra Clean Processing of Silicon Surfaces V

Info:

Periodical:

Solid State Phenomena (Volumes 76-77)

Pages:

311-0

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.76-77.311

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Online since:

January 2001

Authors:

Steven Verhaverbeke, Jason Chi-Hao Shao, Lewis Liu

Keywords:

Cu Clean, Post Dry Etch Cleaning, Via Cleaning

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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