Pattern Dependent Corrosion Effects in HF Based Post Cu CMP Cleanings
p.275
p.275
Effect of Copper on the Breakthrough Voltage of Poly-Si - Poly-Si Capacitors
p.279
p.279
New Insights into Particle Adhesion
p.283
p.283
SC-1 Clean Improvements for Post STI CMP
p.291
p.291
Contamination and Cleaning of Oxide Areas Exposed During Copper CMP in Hydroxylamine Based Slurries
p.295
p.295
Post Copper CMP: a Two Steps Cleaning Recipe
p.299
p.299
Silicon Surface Cleaning after Spacer Dry Etching
p.303
p.303
The Effect of DI Water and Intermediate Rinse Solutions on Post Metal Etch Residue Removal Using Semi-Aqueous Cleaning Chemistries
p.307
p.307
Wet Cleaning of Trenches and Vias after Oxide/Nitride Dry Etch with Cu Exposed
p.311
p.311
The Effect of DI Water and Intermediate Rinse Solutions on Post Metal Etch Residue Removal Using Semi-Aqueous Cleaning Chemistries
Abstract:
You might also be interested in these eBooks
Info:
Periodical:
Solid State Phenomena (Volumes 76-77)
Pages:
307-310
Citation:
Online since:
January 2001
Authors:
Keywords:
Price:
Сopyright:
© 2001 Trans Tech Publications Ltd. All Rights Reserved
Share:
Citation: