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HomeSolid State PhenomenaSolid State Phenomena Vols. 76-77Post Copper CMP: a Two Steps Cleaning Recipe

Post Copper CMP: a Two Steps Cleaning Recipe

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Abstract:

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Ultra Clean Processing of Silicon Surfaces V

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Periodical:

Solid State Phenomena (Volumes 76-77)

Pages:

299-302

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.76-77.299

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Online since:

January 2001

Authors:

Alessio Beverina, J.M. Fabbri, Didier Lévy, F. Tardif, Pascal Besson

Keywords:

Cleaning, CMP, Copper (Cu)

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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