Solid State Phenomena
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.
This special volume is dedicated to the science and technology of the semi-solid processing of metals. Since the recognition of the possibility of manipulating metals in the semi-solid state, during the seventies, this fascinating technology has experienced dynamic development and has led to a whole family of new production processes, new equipment and industrial applications. In order to exploit fully the technical and economic potential of these new ideas, it is important to achieve a better understanding of the microstructural development and flow behavior in order to improve material and process modelling as well as process control.
No present-day research and development program is complete without the inclusion of a robust modeling and numerical simulation component. Models and model-based numerical simulations are extensively used to probe complex materials behavior and structure in order to obtain a deeper insight into the fundamentals of materials. Multi-physics models are becoming increasingly common, with advances in computational science, and are rapidly advancing the basic understanding of materials.
The principal purpose of assembling this special volume was to create a truly international body of peer-reviewed contributions on “Interaction between defects and anelastic phenomena in solids”.
This very special volume on ‘Advanced Structural and Functional Materials for Protection’ focuses on the choice of materials intended for the specific task of protecting civilians and soldiers against the effects of blast, fragmentation weapons and unconventional attacks, and also covers multi-functional materials intended for the enhancement of soldier performance. Protective materials represent one of the greatest challenges to synthesis and processing; due to the extreme requirements of the application.
The recent utilization of nano-sized powders and porous materials has led to the expectation that it will lead to basic breakthrough solutions for prospective nanomaterial products offering high performance and multi-functionalism. For this reason, many industrial countries have financially supported nanostructured materials development and their use in technical innovation.
This collection of 86 peer-reviewed papers covers all aspects of the use of ultra-clean technology for large-scale integration on semiconductors, and cleaning and contamination-control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing.