Solid State Phenomena
Volume is indexed by Thomson Reuters CPCI-S (WoS).
The growing interest in their development is driven by emerging applications and by the integration of smart materials into industrial systems for civilian, industrial, medical and military applications. Among them are composite multiferroic materials which exhibit two or more ferroic features such as ferromagnetism/magnetostriction, ferroelectricity/piezoelectricity or ferroelasticity/shape-memory effects due to their unusual responses: including very large magneto-electric susceptibility, giant magnetostriction and energy-coupling coefficients which approach unity. Other systems include shape-memory and magnetic shape-memory alloys, magnetostrictive materials, magnetorheological fluids and polymers.
The main emphasis of this special volume is placed on new developments in low-dimensional magnetism, magnetic semiconductors and oxides, transport phenomena and spintronics, magnetophotonics, HF magnetic properties and metamaterials, shape memory alloys and magnetocaloric effects, magnetic properties of strongly correlated systems and superconductivity, medicine and geophysics, and applications. Trends in magnetism are also discussed.
Nanocomposite materials constitute a rapidly evolving field of science and technology, of which the first applications are already on the market and many more are expected to follow. The admixture of relatively low amounts of nanoparticles (these are, by definition, any morphology having at least one dimension in the nano-range, i.e. particles, fibres, plates) within a matrix of polymer, ceramic or metal has a dramatic increasing effect upon the resultant properties (volume, surface and functional properties). Unusual property combinations can be obtained; resulting in a new class of materials for almost every application.
This topical volume includes ten invited papers that cover selected areas of the field of solid phase transformations.
This very interesting volume is divided into 24 sections; each of which covers, in detail, one aspect of the subject-matter: I. Industrial robots; II. Microrobotics; III. Mobile robots; IV. Teleoperation, telerobotics, teleoperated semi-autonomous systems; V. Sensors and actuators in mechatronics; VI. Control of mechatronic systems; VII. Analysis of vibration and deformation; VIII. Optimization, optimal design; IX. Integrated diagnostics; X. Failure analysis; XI. Tribology in mechatronic systems; XII. Analysis of signals; XIII. Measurement techniques; XIV. Multifunctional and smart materials; XV. Metallic alloys; XVI. Biomaterials, XVII. Functional composites; XVIII. Adaptive materials; XIX. Piezoelectric materials; XXI. Ceramics and glasses; XXII. New trends in mechatronic and materials science education; XXIV. Teaching materials and laboratory facilities.
The contents of this publication include every conceivable issue related to contamination, cleaning and surface preparation during mainstream large-scale integrated circuit manufacture. Typically, silicon is used as the main semiconductor substrate. However, other semiconducting materials such as SiGe and SiC are currently being used in the source-sink junction areas, and materials such as Ge and III-V compounds are being considered for the transistor channel region of future-generation devices.