Paper Titles
Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer
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Machining Force and Modes for Si Wafer Machining with Rotational Tool
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Wafer Polishing Process with Signal Analysis and Monitoring for Optimum Condition of Machining
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Effects of Wafer Carrier Design on Contact Stress Uniformity in CMP
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Study on Chemical Mechanical Polishing with Ultrasonic Vibration
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Experimental Investigation on Effects of Passivants in the Abrasive-Free Polishing of Copper Film
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Friction Phenomenon in Chemical Mechanical Polishing of Oxide Film
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Diamond Pad Conditioners with Oriented Polycrystalline Diamond Cubes
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Mosaic Diamond Disks with Brazed Pallets for CMP
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Study on Chemical Mechanical Polishing with Ultrasonic Vibration

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Abstract:

Chemical Mechanical Polishing(CMP) is currently the most effective planarization method used in the semiconductor industry. Because of the continuous improvement of the wafer size and line width, the CMP process must be promoted and improved. Many studies have been undertaken to try and achieve both a high material remval rate (MRR) while maintaing a high surface quality of silicon wafer, however up until this point it appears that the two objectives are mutually exclusive. In this paper, an innovative method which integrated ultrasonic vibration assisted machining and CMP (UCMP) has been developed. With the use of ultrasonic vibration, the CMP efficiency and the quality of ploished suface improves considerably as shown in this paper. The basic principle effects of ultrasonic vibration are further illustrated and the experiments had been done to demostrate the proper procedure. The results showed that UCMP achieves a higher material removal rate (MRR) and better surface quality at the same time.

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Advances in Abrasive Technology XIII View Preview

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Periodical:

Advanced Materials Research (Volumes 126-128)

Pages:

311-315

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.126-128.311

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Online since:

August 2010

Authors:

Pei Lum Tso, Yao Cheng Chang

Keywords:

Chemical Mechanical Polishing (CMP), Material Removal Rate (MRR), Planarization, Surface Roughness (SR), Ultrasonic Vibration Assisted Machining

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© 2010 Trans Tech Publications Ltd. All Rights Reserved

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