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Study on Thermal Shock Resistance of Insulated Metal Substrate
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Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy
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Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy

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Abstract:

Sn-Pb solder alloys, widely used in electronic industry, will be restricted because of the toxicity of Pb. That is paramount importance that developing viable alternative lead-free solders for electronic assemblies. Sn-Ag-Cu alloys are better alternative because of its good performance. But they have a melting temperature of 217-225°C that is much higher than that of Sn-Pb eutectic alloy, 183°C. It may be very difficulty to realize industrialization. Sn-Ag-Cu-Ga solder alloys have been studied in this paper, including a series of properties tests, such as melting point, hardness, shear strength and solderability. The best composition of Sn-Ag-Cu-Ga lead-free solder alloy has been obtained.

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Periodical:

Materials Science Forum (Volumes 475-479)

Pages:

1747-1750

DOI:

https://doi.org/10.4028/www.scientific.net/MSF.475-479.1747

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Online since:

January 2005

Authors:

Guohai Chen, Ju Sheng Ma, Zhi Ting Geng

Keywords:

Hardness, Lead-Free Solder, Melting Point, Shear Strength, Sn-Ag-Cu-Ga, Spread Ratio, Wetting Angle

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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