Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad

Pei Lum Tso; Cheng Yi Shih

doi:10.4028/www.scientific.net/KEM.389-390.487

Paper Titles

Subsurface Structures of Monocrystalline Silicon Generated by Nanogrinding
p.465

Complete Recovery of Subsurface Structures of Machining-Damaged Single Crystalline Silicon by Nd:YAG Laser Irradiation
p.469

Study on Adhesion Removal Model in CMP SiO₂ ILD
p.475

Study on the CMP Pad Life with its Mechanical Properties
p.481

Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad
p.487

A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition
p.493

Effect of Conditioning Parameters on Surface Non-Uniformity of Polishing Pad in Chemical Mechanical Planarization
p.498

Achieving a Damage-Free Polishing of Mono-Crystalline Silicon
p.504

Effect of Polishing Time and Pressure on Polishing Pad Performance
p.510

HomeKey Engineering MaterialsKey Engineering Materials Vols. 389-390Polishing Characteristics on Silicon Wafer Using...

Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad

Abstract:

A mechanical polishing process was used to reduce surface roughness through mechanical fracturing and removal of the substrate’s roughened regions. It was thus necessary to understand the effect of grain size and morphology on the material removal mechanisms of silicon wafers by stepwise polishing using a fixed abrasive pad. A hybrid process combining the optimized silicon polishing recipe for rapid roughness reduction with a micro-sized diamond, and then polishing using a nano-sized diamond to produce a final finished surface, may be the optimum approach. The best result using the hybrid polishing process was the surface roughness (Ra) value of 3.32 nm.

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Periodical:

Key Engineering Materials (Volumes 389-390)

Pages:

487-492

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.389-390.487

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Online since:

September 2008

Authors:

Pei Lum Tso, Cheng Yi Shih

Keywords:

Fixed Abrasive Pad, Hybrid Process, Mechanical Polishing

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References

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