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Articles by author: Mauro Alessandri

• AlCu Metal Line Corrosion: A Case Study
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p367)
• All-Wet Stripping of FEOL Photoresist Using Mixtures of Sulphuric Acid
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p105)
• Behaviour of High-k Dielectric Materials with Classical Cleaning Chemistries
  Published in: Ultra Clean Processing of Silicon Surfaces VI (p15)
• Cu Surface Characterization after Wet Cleaning Processes
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p371)
• Etch Rate Depth Profiling by Single Wafer Etching Equipment
  Published in: Ultra Clean Processing of Silicon Surfaces VII (p107)
• Etch Rate Profile Characterization of High-κ Materials
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p63)
• Fe and Cu Removal Efficiency in HF-DIW/O₃ Cleaning Sequence
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p109)
• Impact of RF Oxygen Plasma on Thermal Oxide Etch-Rate
  Published in: Ultra Clean Processing of Semiconductor Surfaces VIII (p125)
• Influence of Dry Ashing and Wet Treatments on NVM Metal Gate Structures
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p257)
• Influence of Wet Cleaning on Tungsten Deposited with Different Techniques
  Published in: Ultra Clean Processing of Semiconductor Surfaces IX (p197)
• Particle Addition Behaviour of Oxide Stripping by HF Solutions
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p35)
• Particle Removal Efficiency and Silicon Roughness in HF-DIW/O₃/Megasonics Cleaning
  Published in: Ultra Clean Processing of Silicon Surfaces IV (p27)