Advanced Materials Research
Vol. 38
Vol. 38
Advanced Materials Research
Vols. 33-37
Vols. 33-37
Advanced Materials Research
Vol. 32
Vol. 32
Advanced Materials Research
Vol. 31
Vol. 31
Advanced Materials Research
Vols. 29-30
Vols. 29-30
Advanced Materials Research
Vols. 26-28
Vols. 26-28
Advanced Materials Research
Vols. 24-25
Vols. 24-25
Advanced Materials Research
Vol. 23
Vol. 23
Advanced Materials Research
Vol. 22
Vol. 22
Advanced Materials Research
Vols. 20-21
Vols. 20-21
Advanced Materials Research
Vols. 18-19
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Advanced Materials Research
Vols. 15-17
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Advanced Materials Research
Vols. 13-14
Vols. 13-14
Advanced Materials Research Vols. 24-25
Paper Title Page
Abstract: Cryogenic polishing single silicon wafer with nano-sized CeO2 abrasives can be known as
cryogenic fixed abrasives CMP (CFA-CMP). The abrasive slurry was made of nano-sized CeO2
particles dispersed in de-ionized water with a surfactant and the polishing slurry froze to form
cryogenic polishing pad. Then the polishing tests of the blanket silicon wafers in the presence of the
cryogenic polishing pad containing the nano-particulates were carried out. The morphologies and
surfaces roughness of the polished silicon wafers were observed and examined on an atomic force
microscope (AFM). The results show that a super smooth surface with roughness of 0. 293 nm is
obtained within 5000 nm× 5000 nm and the removal of material is dominated by plastic flowage.
177
Abstract: In this study, rock minerals of natural stone were finely polished with loose abrasive and
ELID technology to study the surface behaviours. After these rock specimens were polished to ultra
smooth surfaces, the surface characteristics were observed with microscope and analyzed with
surface texture analyzer. It was found that the calcite and fluorite minerals could be polished to high
surface quality with fine loose aluminum oxide abrasive. But ultra smooth quartz surface must be
finished with superabrasive ELID polishing technology. The weakly acidic coolant might bring
chemical damage to calcite and fluorite minerals under the condition of ELID polishing process.
183
Abstract: Laser surface texturing (LST) technology that is firstly used in rollers, is a specialized
surface engineering process capable of enhancing the surface material properties, wear resistance,
fretting fatigue life and reducing friction. This practical technology of the LST process is based on a
pulsating laser beam that, by material ablation, generates the optimum topographical surface. In order
to exploit the full potential of the process, a great amount of research has explored from the material
removal mechanics to the development of the LST process. This paper reports on the LST research
involving the LST technology surveying process optimization, LST equipment and its industrial
applications. The paper also highlights the forming theory describing the skin-pass process of
transferring the textured roller’s surface structure onto the steel sheet, and the laser-matter interaction
that occurs when and intense laser beam is tightly focused in the workpiece surface. It presents the
influence of various factors affecting the textured workpiece performance together with the
investigations into tribology of textured components. The paper also discusses these developments
and some fundamental on future LST research.
189
Abstract: The potential of abrasive waterjet technology was investigated as a method to polish
Z-blocks of synthetic quartz crystals. The polished surfaces were characterized by surface
roughometer and scanning electron microscopy. The main factors affecting the surface roughness and
the erosion mechanisms related to material removal were analysed. It is found that abrasive mesh,
water pressure and jet incidence angle are the main factors affecting the surface roughness. By
contrast, the influence of traverse speed on the surface roughness is small. Under certain controlled
conditions, the erosion mechanisms of synthetic quartz crystals are plastic flow, leaving a crack-free
surface by low-middle pressure micro abrasive waterjet.
195
Abstract: Cd1−xZnxTe (CZT) is an excellent ternary compound semiconductor. CZT is the most
suitable substrate material for Hg1−yCdyTe epitaxial growth and can make the detector itself. The
researchers have done a lot of works on the hard and brittle material removal mechanism in lapping
process. however, no published articles are available regarding the removal mechanism and the
abrasives embedding mechanism of the soft and brittle material in lapping progress .and there is its
own characteristic if the hard abrasives machining the soft and brittle material in lapping progress,
the objective of this paper is to build the physical model ,and divide the abrasive into four kinds of
abrasives , they are two-body abrasive ,three-body abrasive ,embedded abrasive and small abrasive,
and the authors analyze the effects on the material surface of the above abrasives. At last, design
series of experiments, through analyzing the results and observe the surface morphology, the
authors prove that the physical model is correct.
201
Study on Macro/Micro Complex Feed Mechanism in Dry-ECD Assisted Truing and Dressing of Diamond Wheel
Abstract: A novel truing and dressing method, namely dry electrical discharge (dry-ECD) assisted
truing and dressing, is proposed to overcome the shortcomings associated with conventional
mechanical dressing methods, ELID and ECD methods. The macro/micro complex feed mechanism
in dry –ECD assisted truing and dressing equipment is designed to maintain continuous discharge
between the tool electrode and diamond wheel in dry-ECD automatically. A series of basic
performance experiments of the micro feed mechanism show that the position accuracy of the
micro-feed mechanism is below 0.35μm using the micro-positioning control system. Whereas,the
position accuracy of the mobile negative electrode is 1μm without macro/micro complex feed
mechanism.
211
Abstract: The grinding force was one of the most important parameters, almost related with all the
parameters in grinding. In this paper, the grinding force model was established by a new method.
The abrasive grains were analyzed using the statistical probability method. The abrasive grains were
divided into two types, one was the cutting abrasive grain, and the other was contacting abrasive
grain. The force analysis of a single abrasive grain was done. The grinding force model was
established on the basis of the statistical probability method and the force analysis of a single
abrasive grain. Theoretical analysis was verified by the experiment. The results indicated, the
experimental results agree well with the theoretical prediction. The model can accurately predict the
grinding force.
217
Abstract: Based on the kinematic analysis of the double sided polishing process, the equation of
relative velocity (the workpiece to the polishing plate) is established. According to the Preston’s
equation, the function of stock removal uniformity is presented. By computer simulations of the
machining process, the effects of rotating speed ratios (the carrier revolution speed to plate rotating
speed, carrier rotating speed to plate speed) on the stock removal uniformity are discussed in this
paper. At last, some experiments have been done for validating the theoretical study of stock
removal uniformity. The results show that, the computer simulation can estimate and conduct the
experiment result in double-sided polishing process.
223
Abstract: Tungsten carbide which is a hard and brittle material was ground by cast-iron bonded
diamond wheel with ELID (Electrolytic In-Process Dressing) technique, for the purpose of getting
high efficiency, super-precision machining. Three kinds of cast-iron bonded diamond wheels with
different grain size were adopted to get different grinding efficiency and surface quality of
workpieces. The grinding properties of cast-iron bonded grinding wheels with different grain size
and the ground surface quality of tungsten carbide are discussed in this paper. The experiment results
indicate that, under the same feeding amount, the grinding efficiency of the wheel with bigger grain
size is higher, and it could make the dimension accuracy of the workpiece controllable, but the
wheel with smaller grain size could get better ground surface quality. The two grinding phases are
decided by the ratio between the size of abrasive grain and the thickness of the oxide layer on the
grinding wheel.
229
Abstract: Grinding forces, protrusion and wear of diamond grit have been studied in grinding granite
with a single-layer brazed diamond wheel. The experiment results indicate that the primary wear
progression of diamond grits in the whole grinding process follows the mode of whole,
micro-fractured, macro-fractured and pull-out when grinding granite with the brazed diamond wheel.
The proportions of the whole, fractured, pull-out, break flat and the mean height protrusion of grains
are more closely related to grinding forces. The grinding forces decreased with the increasing
proportions of whole and break flat grains, and the tangential and normal force components increased
with the gradual wear of the brazed diamond wheel during a long-time grinding process.
233