Dicing Laminated Wafer for QFN 3D Stacked Die Packaging

Abstract:

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Nowadays, die attach film (DAF) gaining popularity in microelectronic packaging as integral part in facilitating the growth of wafer level packaging and stacked die packaging. DAF applied to the backside of wafers prior to saw have many advantages, such as the elimination of the epoxy dispensed process step and the reduction of epoxy related failure mode. However, the dicing process for DAF wafer usually associated with sidewall chipping, DAF whiskering and crack that will affect reliability of Quad Flat Non-Leaded (QFN) stacked die. Blade properties and characteristics are the crucial factor in analyzing the DAF dicing results. In this paper, we evaluate the blade characteristics before and after DAF wafer dicing process for our stacked die packaging. The qualitative measure by means of the Scanning Electron Microscope (SEM) and Energy Dispersive X-Ray (EDX) analysis were performed in order to understand the lamination and dulling effect on blade surface. The obtained results showed that sawing polymeric material such as wafer laminated with DAF induces lamination of polymeric material onto the blade surface and reduce blade cutting edge. As a result, reduce the quality of DAF dicing process.

Info:

Periodical:

Edited by:

S. J. CHUA, J. H. TENG, O. WADA, R. DE LA RUE and X. H. TANG

Pages:

202-205

DOI:

10.4028/www.scientific.net/AMR.31.202

Citation:

S. Abdullah et al., "Dicing Laminated Wafer for QFN 3D Stacked Die Packaging", Advanced Materials Research, Vol. 31, pp. 202-205, 2008

Online since:

November 2007

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$35.00

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