New Glass Sealing Method with Lead-Free Solders

Abstract:

Article Preview

We have developed a novel technique of joining a pair of glass substrates. In the process, molten solder penetrates the gap between the glass substrates while the solder-glass interfaces are being activated by friction. The activation is given by a metal plate, which slides through the gap along the edge of the paired glass substrates and brings in the molten solder by capillary-action. A Ti-doped Sn-Zn eutectic solder showed good hermetic sealing of glass. A eutectic In-Sn solder also yielded good joining, especially at low sealing temperatures.

Info:

Periodical:

Edited by:

P. VINCENZINI

Pages:

1604-1607

DOI:

10.4028/www.scientific.net/AST.45.1604

Citation:

K. Sakaguchi et al., "New Glass Sealing Method with Lead-Free Solders", Advances in Science and Technology, Vol. 45, pp. 1604-1607, 2006

Online since:

October 2006

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.