New Glass Sealing Method with Lead-Free Solders

Koichi Sakaguchi; Shinjiro Domi; Katsuaki Suganuma

doi:10.4028/www.scientific.net/AST.45.1604

Paper Titles

Transient-Liquid-Phase and Liquid-Film-Assisted Joining of Ceramics
p.1568

Soldering and Brazing Metals to Ceramics at Room Temperature Using a Novel Nanotechnology
p.1578

Transient Liquid Phase Bonding of Ceramics and Metal Matrix Composites
p.1588

Metallization of AlN for Electronics
p.1594

New Glass Sealing Method with Lead-Free Solders
p.1604

Nickel Aluminides as a “Filler” for Joining Ceramics and Metals
p.1608

Properties Dependency of Alumina - Steel Joints on Bonding Technique
p.1614

High Temperature Plastic Flow and Ductility in Polycrystalline Oxide Ceramics: Doping Effect and Related Phenomena
p.1620

Grain Boundary Diffusion in Cation-Doped Superplastic 3Y-TZP
p.1626

HomeAdvances in Science and TechnologyAdvances in Science and Technology Vol. 45New Glass Sealing Method with Lead-Free Solders

New Glass Sealing Method with Lead-Free Solders

Abstract:

We have developed a novel technique of joining a pair of glass substrates. In the process, molten solder penetrates the gap between the glass substrates while the solder-glass interfaces are being activated by friction. The activation is given by a metal plate, which slides through the gap along the edge of the paired glass substrates and brings in the molten solder by capillary-action. A Ti-doped Sn-Zn eutectic solder showed good hermetic sealing of glass. A eutectic In-Sn solder also yielded good joining, especially at low sealing temperatures.