Faceting of Ʃ3 Grain Boundaries in Cu: Three-Dimensional Wulff Diagrams

Abstract:

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Diffusional growth of the grain boundary (GB) groove permits one to measure the ratio between GB energy sGB and surface energy ssur. The faceting of twin tilt grain boundaries in Cu has been studied using the GB thermal groove method. No rough facet edges were observed. It means that melting temperature is lower than the roughening temperature for the observed facets in Cu. The influence of orientation and misorientation deviation Dq = ½q – qS½ from coincidence misorientation qS has been studied. By increase of Dq the energy of (100)CSL facet increases. The convenient method for construction 3D three-dimensional Wulff diagrams was found. The 3- dimensional Wulff diagrams were constructed using this method and measured sGB / ssur values.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 237-240)

Edited by:

M. Danielewski, R. Filipek, R. Kozubski, W. Kucza, P. Zieba, Z. Zurek

Pages:

584-592

DOI:

10.4028/www.scientific.net/DDF.237-240.584

Citation:

Y. Kucherinenko et al., "Faceting of Ʃ3 Grain Boundaries in Cu: Three-Dimensional Wulff Diagrams", Defect and Diffusion Forum, Vols. 237-240, pp. 584-592, 2005

Online since:

April 2005

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Price:

$35.00

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