[1]
W.-D. Lee, C.-W. Lian, S.-J. Wang, Y.-H. Yu, O. Cheng, L.S. Huang, and M.-C. Wang, "Electrical quality of 28 nm HK/MG MOSFETs with PDA and DPN treatment" in 2014 International Symposium on Next-Generation Electronics (ISNE), 2014, p.1–4.
DOI: 10.1109/isne.2014.6839328
Google Scholar
[2]
D.-C. Zhang, C.-C. Chou, H.-H. Chen, S.-Z. Chen, J.-M. Chen, H.-Y. Bor, W.-H. Lan, and M.-C. Wang, "Fringe gate leakage of 28 nm HK/MG nMOSFETs with nitridation treatments," in 2020 3rd IEEE International Conference on Knowledge Innovation and Invention(ICKII), 2020, p.1–3.
DOI: 10.1109/ickii50300.2020.9318939
Google Scholar
[3]
S. M. Sze, Y. Li, and K. K. Ng, *Physics of Semiconductor Devices*. Hoboken, NJ: John Wiley & Sons, Inc., 2021.
Google Scholar
[4]
E. Vandamme, P. Jansen, and L. Deferm, "Modeling the subthreshold swing in MOSFETs," IEEE Electron Device Letters, vol. 18, no. 8, p.369–371, 1997.
DOI: 10.1109/55.605442
Google Scholar
[5]
C. Hu, *Modern Semiconductor Devices for Integrated Circuits*. Upper Saddle River, N.J: Prentice Hall, 2010.
Google Scholar
[6]
H.-S. Kim, S.-W. Han, W.-H. Jang, C.-H. Cho, K.-S. Seo, J. Oh, and H.-Y. Cha, "Normally-off GaN-on-Si MISFET using PECVD Sion gate dielectric," IEEE Electron Device Letters, vol. 38, no. 8, p.1090–1093, 2017.
DOI: 10.1109/led.2017.2720719
Google Scholar
[7]
Y. Wei, J. Yao, Q. Zhang, G. Sang, Y. Bao, J. Gao, J. Li, J. Luo, and H. Yin, "Sub-5-Å La2O3 in situ dipole technique for large VFB modulation with EOT reduction and improved interface for HKMG technology," IEEE Transactions on Electron Devices, vol. 71, no. 1, p.746–751, 2024.
DOI: 10.1109/ted.2023.3335900
Google Scholar
[8]
R. Singanamalla, H. Yu, G. Pourtois, I. Ferain, K. Anil, S. Kubicek, T. Hoffmann, M. Jurczak, S. Biesemans, and K. De Meyer, "On the impact of TiN film thickness variations on the effective work function of poly-Si/TiN/SiO2 and poly-Si/TiN/HfSiON gate stacks," IEEE Electron Device Letters, vol. 27, no. 5, p.332–334, 2006.
DOI: 10.1109/led.2006.872916
Google Scholar
[9]
T. Watanabe, A. Menjoh, T. Mochizuki, S. Shinozaki, and O. Ozawa, "A 100Å thick stacked SiO2/Si3N4/SiO2 dielectric layer for memory capacitor," in 23rd International Reliability Physics Symposium, 1985, p.18–23.
DOI: 10.1109/irps.1985.362069
Google Scholar
[10]
N. Breil, A. Carr, T. Kuratomi, C. Lavoie, I.-C. Chen, M. Stolfi, K. D. Chiu, W. Wang, H. Van Meer, S. Sharma, R. Hung, A. Gelatos, J. Jordan-Sweet, E. Levrau, N. Loubet, R. Chao, J. Ye, A. Ozcan, C. Surisetty, and M. Chudzik, "Highly-selective superconformal CVD Ti silicide process enabling area-enhanced contacts for next-generation CMOS architectures," in 2017 Symposium on VLSI Technology, 2017, pp. T216–T217.
DOI: 10.23919/vlsit.2017.7998177
Google Scholar
[11]
B. Doris, D. Park, K. Settlemyer, P. Jamison, D. Boyd, Y. Li, J. Hagan, T. Staendert, J. Mezzapelli, D. Dobuzinsky, B. Linder, V. Narayanan, S. Callegari, E. Gousev, K. Guarini, R. Jammy, and M. Leong, "Ultra-thin SOI replacement gate CMOS with ALD TaN/high-k gate stack," in IEEE VLSI-TSA International Symposium on VLSI Technology, 2005 (VLSI-TSA-Tech), 2005, p.101–102.
DOI: 10.1109/vtsa.2005.1497095
Google Scholar
[12]
M.-C. Wang, C.-K. Du, M.-R. Peng, S.-J. Wang, S.-Y. Chen, C.-H. Liu, O. Cheng, L. S. Huang, and S. C. Lee, "Trend of subthreshold swing with DPN process for 28 nm N/PMOSFETs," in 2013 International Symposium on Next-Generation Electronics, 2013, p.389–392.
DOI: 10.1109/isne.2013.6512375
Google Scholar
[13]
S.-E. Huang, W.-X. You, and P. Su, "Mitigating DIBL and short-channel effects for III-V FinFETs with negative-capacitance effects," IEEE Journal of the Electron Devices Society, vol. 10, p.65–71, 2022.
DOI: 10.1109/jeds.2021.3133453
Google Scholar
[14]
A. Kumar, M. Pattanaik, P. Srivastava, and K. K. Jha, "Dual metal hetero-dielectric GAAFET based energy-efficient digital circuits," in 2020 International Conference on Smart Electronics and Communication (ICOSEC), 2020, p.1206–1209.
DOI: 10.1109/icosec49089.2020.9215330
Google Scholar
[15]
M. Godara, C. Madhu and G. Joshi, "Comparison of Electrical Characteristics of 28 Nm Bulk MOSFET and FDSOI MOSFET," 2018 IEEE Electron Devices Kolkata Conference (EDKCON), Kolkata, India, 2018, pp.413-418.
DOI: 10.1109/EDKCON.2018.8770413
Google Scholar