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Key Engineering Materials
Vol. 249
Key Engineering Materials
Vol. 248
Key Engineering Materials
Vol. 247
Key Engineering Materials
Vols. 245-246
Key Engineering Materials
Vols. 243-244
Key Engineering Materials
Vols. 240-242
Key Engineering Materials
Vols. 238-239
Key Engineering Materials
Vol. 237
Key Engineering Materials
Vols. 233-236
Key Engineering Materials
Vols. 230-232
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Vols. 228-229
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Vol. 227
Key Engineering Materials
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Key Engineering Materials Vols. 238-239

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.238-239

ToC:

Table of Contents

Paper Title Page

B-Spline Based Wavefront Reconstruction for Lateral Shearing Interferometric Measurement of Engineering Surfaces
Authors: X. Liu, Y. Gao
169
Evaluation of Surfaces of Single SiC Crystal Polished with Various Kinds of Particles
Authors: Junji Watanabe, Makoto Fujimoto, Yasumichi Matsumoto, Noritaka Kuroda, Osamu Eryu
175
Grinding Performance Improvement by a Special Coolant Superimposed with Megasonic Vibration
Authors: Kiyoshi Suzuki, Hu Bin Qun, Shoji Mishiro, Katsutoshi Tanaka, Tomoyasu Imai, Anurag Sharma, Tetsutaro Uematsu, Manabu Iwai
183
Effects of Megasonic Coolant on Cylindrical Grinding Performance
Authors: Haruhisa Sakamoto, Shinji Shimizu, Kiyoshi Suzuki, Tetsutaro Uematsu, Atsuo Shimotokube
189
Effects of the Supplied Cold-Air Condition on Grinding Temperature in Cold-Air Jet Grinding
Authors: Shigetoshi Ohmori, Masayoshi Tateno, Kunio Kokubo
195
An Improved Technique to Determine Coolant Flow Patterns for In-Process Measurement
Authors: S. Tse, Y. Gao, Y. Kuen, Z. Tao
199
Behavior of the Coolant in Grinding with a Floating Nozzle
Authors: Shinichi Ninomiya, Shin-Ichi Tooe, Kiyoshi Suzuki, Tetsutaro Uematsu
205
Application of an Oscillating Spindle to Machining Processes
Authors: Hwa Soo Lee, S. Sasaki, T. Yamada, K. Mizukawa, Y. Ono
213
Ultra Precision Polishing with Oscillation Speed Control: an Analysis of the Pressure Distribution and Profile
Authors: Kenichiro Yoshitomi, Atsunobu Une, Masaaki Mochida
219
Physical and Chemical Characteristics of the Ceramic Conditioner in Chemical Mechanical Planarization
Authors: Jum Yong Park, Dae Hong Eom, Sang Ho Lee, Beom-Young Myung, Sang Ick Lee, Jin Goo Park
223

Showing 31 to 40 of 70 Paper Titles

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