Advances in Grinding and Abrasive Technology XIII

Volumes 304-305

doi: 10.4028/

Paper Title Page

Authors: Y.X. Zhang, Ren Ke Kang, Dong Ming Guo, Zhu Ji Jin

Abstract: In order to obtain higher ground surface quality of silicon wafers, it is essential to better understand the grinding mechanism. This study...

Authors: H.H. Zhao, Guang Qi Cai, X.J. Gao

Abstract: The theory model of the indent experiment of the brittle material was established, its specific energy was analyzed, and the calculation...

Authors: L. Zheng, Yin Biao Guo, Z.Z. Wang

Abstract: This paper puts forward an intelligent single-plane biaxial balance monitor system, which is used in ultra-precision grinding. It adopts the...

Authors: L.J. Zhong, Ai Bing Yu, S.Y. Yu, Hai Yan Du

Abstract: A new method is proposed for machinability comprehensive evaluation of engineering ceramic materials based on digraph theory. Machinability...

Authors: Fang Hong Sun, X.K. Li, Y. Wang, Ming Chen

Abstract: SiC-particle-reinforced aluminum-based metal matrix composite is one of the important composites among the metal matrix composites, for...

Authors: A.L. Wang, Y.Q. Wei, X.J. Zhu, Jan Yong Wang, Z.Z. Zheng, Xu Dong Sun, Z.Z. Liu

Abstract: Green machining fluids of oil-filmed water-droplets (OW) can be produced by means of combined mist-jet with cooled air, minimum naturally...

Authors: Bin Lin, Hong Tao Zhu, L. Han, S.Y. Yu

Abstract: Ceramic is prone to engender surface/subsurface crack damage layer because of great grinding force and high brittle. Prediction of crack...

Authors: Y.H. Ren, Zhi Xiong Zhou, Zhao Hui Deng

Abstract: Surface microgrinding of the nanostructured WC/12Co coatings have been undertaken with diamond wheels under various conditions....

Authors: X.M. Cheng, Long Shan Wang, Guang Fu Li

Abstract: During the process of plunge grinding, a test piece can be axially grooved with thermocouple embedded, thermo-electromotive force will be...

Authors: Xiao Guang Guo, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin

Abstract: Molecular dynamics (MD) simulation is carried out to analyze the effects of abrasive ngrain size and cut depth on monocrystal silicon...


Showing 51 to 60 of 124 Paper Titles