Effects of Thermal Deformation of Multi-Wire Saw’s Wire Guides and Ingot on Slicing Accuracy

Abstract:

Warp accuracy and nanotopography in the silicon wafer slicing process influence the final quality of the wafer. Therefore, methods to improve these factors are important. And this will require the achievement of low costs and high quality processing – conflicting requirements – with larger sized wafers than in previous generations. The present study was performed to assess mechanical factors, such as machine static accuracy and thermal deformation, to improve the accuracy of multi-wire saws. This report deals with the influence of thermal deformation of the ingot and wire guides upon processing accuracy, and describes the assessment results.

• Periodical: Key Engineering Materials (Volumes 389-390)
• Pages: 442-447
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.389-390.442
• Online since: September 2008
• Authors: Yoshinori Abe, Ken Ichi Ishikawa, Hitoshi Suwabe
• Keywords: Slicing, Multi-Wire Saw, Nanotopography, Silicon Wafer

References

[1] JEITA Semiconductor Technology Roadmap Expert Committee of Japan: ITRS 2005 Edition, Japan Electronics and Information Technology Association.

[2] Abe, Hamasaki, Ishikawa and Suwabe: Development and slicing performance of high accuracy multi-wire saw, J. Jpn. Soc. Abras. Technol., Vol. 52 No. 1 (2008) 34-39.