Influence of Aluminum Compensation Effects in 4H-SiC on the Performance of VDMOS Transistors

Article Preview

Abstract:

The compensation of charge carriers is an important aspect to be considered in Aluminum doped areas in 4H-SiC. In this paper, a straightforward method has been found to implement compensation effects into a basic device simulation model and to improve the conformance of electrical measurement and simulation results. By implementing the compensation factors, which depend on Aluminum doping concentration, device simulation in combination with basic device cell structure can be used to create electrical characteristics that are in accordance with measured characteristics. This is a simple alternative for complex process simulation, taking into account physical effects like defects in the crystal structure. The method was used for simulation of lateral MOSFETS transfer characteristic as well as VDMOS blocking characteristic. Found compensation values were 80 % in the 1.5 ∙ 1017 cm-3 Al-doped channel region and 23% in the deep, 7.5 ∙ 1017 cm-3 Al-doped, shielding region.

You might also be interested in these eBooks

Info:

Periodical:

Materials Science Forum (Volume 1004)

Pages:

843-849

Citation:

Online since:

July 2020

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2020 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] T. Kimoto, Material Science and Device Physics in SiC Technology for High-Voltage Power Devices,, Jpn. J. Appl. Phys. 54 040103, (2015).

DOI: 10.7567/jjap.54.040103

Google Scholar

[2] Z. Tian, N.R. Quick and A. Kar, Laser-Enhanced Diffusion of Nitrogen and Aluminum Dopants in Silicon Carbid,, Acta Materialia, Vol. 54, Issue 16, pp.4273-4283, (2006).

DOI: 10.1016/j.actamat.2006.05.020

Google Scholar

[3] T. Troffer, M. Schandt, T. Frank et al, Doping of SiC by Implantation of Boron and Aluminum,, Phys. Stat. Sol. A, 162, 277, (1997).

DOI: 10.1002/1521-396x(199707)162:1<277::aid-pssa277>3.0.co;2-c

Google Scholar

[4] M. Rambach, A.J. Bauer and H. Ryssel, Electrical and Topographical Characterization of Aluminum Implanted Layers in 4H-SiC,, Phys.Stat.Sol.(b) 245, No. 7, pp.1315-1326, (2008).

DOI: 10.1002/pssb.200743510

Google Scholar

[5] N. D. Arora et al, Electron and Hole Mobilities in Silicon as a Function of Concentration and Temperature,, IEEE Transactions on Electron Devices, vol. ED-29, no. 2, p.292–295, (1982).

DOI: 10.1109/t-ed.1982.20698

Google Scholar

[6] C. Canali et al., Electron and Hole Drift Velocity Measurement in Silicon and Their Empirical Relation to Electric Field and Temperature,, IEEE Transactions on Electron Devices, vol. ED-22, no. 11, p.1045–1047, (1975).

DOI: 10.1109/t-ed.1975.18267

Google Scholar

[7] C. Lombardi et al., A Physically based Mobility Model for Numerical Simulation of Nonplanar Devices,, IEEE Transactions on Computer-Aided Design, vol. 7, no. 11,p.1164–1171, (1988).

DOI: 10.1109/43.9186

Google Scholar

[8] J. Weisse et al., Aluminum Acceptor Activation and Charge Compensation in Implanted p-Type 4H-SiC,, AIP Advances 9, p.055308, (2019).

DOI: 10.1063/1.5096440

Google Scholar

[9] J. Weisse et al., On the Origin of Charge Compensation in Aluminum-Implanted n-Type 4H-SiC by Analysis of Hall Effect Measurements,, Mat. Sci. F., 1662-9752, Vol.963, pp.433-436, (2018).

DOI: 10.4028/www.scientific.net/msf.963.433

Google Scholar

[10] S. Potbhare et al, A Physical Model of High Temperature 4H-SiC MOSFETs,, IEEE, Transactions on Electron Devices 55, 2029, (2008).

DOI: 10.1109/ted.2008.926665

Google Scholar

[11] S. Potbhare et al, Numerical and Experimental Characterization of 4H-Silicon Carbid Metal-Oxide-Semiconductor Field-Effect Transistors,, J. Appl. Phys., 100(4), 044515.1-044515.8, (2006).

DOI: 10.1063/1.2335967

Google Scholar

[12] J. Wörle, Approachting the SiO2/SiC Interface: Novel Concepts for the Characterization of the Near Interface Region,, Doctoral Thesis, DOI 10.3929/ethz-b-000353158, (2019).

Google Scholar

[13] V. Uhnevionak, Doctoral Thesis, Simulation and Modeling of Silicon Carbide Devices,, urn:nbn:de:bvb:29-opus4-61975, (2015).

Google Scholar

[14] M. Hauck et al Communications Physics, An Adapted Method for Analyzing 4H Silicon Carbid Metal-Oxide Semiconductor Field-Effect Transistors,, Volume 2, Article number: 5, (2019).

DOI: 10.1038/s42005-018-0102-8

Google Scholar

[15] D. K. Schroder, Semiconductor Material and Device Characterization,, Wiley, (2015).

Google Scholar

[16] S. M. Sze and K. K. Ng, Physics of Semiconductor Devices,, Wiley, (2007).

Google Scholar

[17] A. F. Basile and P. M. Mooney, Modeling of High-Frequency Capacitance-Voltage Characteristics to Quantify Trap Distributions near SiO2/SiC Interfaces,, Journal of Applied Physics 111, 094509, (2012).

DOI: 10.1063/1.4712431

Google Scholar

[18] L. Zhao et al, Analyze Punch-through and Reach-trough Breakdown Voltage in N+PN+ and N+P+NN+ Sandwich Structures,, DOI 10.1109/piers.2017.8262041, Prog. Electromag. Res. Symp., Spring (PIERS), St Petersburg, (2017).

DOI: 10.1109/piers.2017.8262041

Google Scholar

[19] M. Kocher et al, Determination of Compensation Ratios of Al-implanted 4H-SiC by TCADModelling of TLM Measurement,, Mat. Sci. F., Vol. 963, pp.445-448, (2019).

DOI: 10.4028/www.scientific.net/msf.963.445

Google Scholar

[20] J. Weisse et al, Analysis of Compenstion Effects in Aluminum-Implanted 4H-SiC Devices,, Mat. Sci. F, Vol.924, pp.184-187, (2018).

Google Scholar