Demonstration of 2kV SiC Deep-Implanted Super-Junction PiN Diodes

Article Preview

Abstract:

We report successful demonstration of 2kV, SiC super-junction (SJ) PiN diodes formed by deep implantation of Al and N. In our devices, alternating 12μm deep n-type and p-type SJ pillars fabricated on a 10μm pitch and result in a SJ diode with a measured blocking voltage 500V higher than comparable non-SJ diodes. Four activation anneals ranging from 1700 °C to 2000 °C were compared for effectiveness in eliminating post-implant lattice damage, and the optimum anneal condition was identified.

You have full access to the following eBook

Info:

Periodical:

Materials Science Forum (Volume 1062)

Pages:

477-481

Citation:

Online since:

May 2022

Export:

Share:

Citation:

* - Corresponding Author

[1] A. Bolotnikov et al., 2015 IEEE Appl. Power Electron. Conf. Expo., p.2445–2452, (2015).

Google Scholar

[2] P. A. Losee et al., Mater. Sci. Forum, vol. 858, p.876–879, May (2016).

Google Scholar

[3] L. Knoll et al., 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD), May 2018, p.451–454.

DOI: 10.1109/ispsd.2018.8393582

Google Scholar

[4] L. Han, L. Liang, Y. Kang, and Y. Qiu, IEEE Trans. Power Electron., vol. 36, no. 2, p.2080–2093, Feb. (2021).

Google Scholar

[5] Q. Zhang and A. K. Agarwal, phys. stat. sol., vol. 206, no. 10, p.2431–2456, (2009).

Google Scholar

[6] T. Tanaka et al., 2018 IEEE Int. Electron Devices Meet., p.8.2.1-8.2.4, (2019).

Google Scholar

[7] R. Kosugi et al., 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD), May 2019, p.39–42.

DOI: 10.1109/ispsd.2019.8757682

Google Scholar

[8] R. Ghandi, A. Bolotnikov, D. Lilienfeld, S. Kennerly, and R. Ravisekhar, 2019 31st International Symposium on Power Semiconductor Devices and ICs (ISPSD), May 2019, p.179–182.

DOI: 10.1109/ispsd.2019.8757568

Google Scholar

[9] R. Ghandi, A. Bolotnikov, S. Kennerly, C. Hitchcock, P. Tang, and T. P. Chow, 2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD), Sep. 2020, p.126–129.

DOI: 10.1109/ispsd46842.2020.9170171

Google Scholar

[10] P. Thieberger et al., Nucl. Instruments Methods Phys. Res. Sect. B Beam Interact. with Mater. Atoms, vol. 442, p.36–40, Mar. (2019).

Google Scholar

[11] V. Simonka, A. Hossinger, J. Weinbub, and S. Selberherr, IEEE Trans. Electron Devices, vol. 65, no. 2, p.674–679, Feb. (2018).

DOI: 10.1109/ted.2017.2786086

Google Scholar