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Correlation Study of Physical and Optical Total Thickness Variation in 4H-SiC Substrates

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Abstract:

Accurate total thickness variation (TTV) measurement is essential for silicon carbide (SiC) wafer manufacturing and process control. This work evaluates the accuracy of interferometric TTV measurements using the Corning Tropel FlatMaster MSP system, benchmarked against a dual-source chromatic white light (CWL) profilometer. We investigate the influence of spatial refractive index variation on interferometric accuracy by comparing MSP and CWL results. The analysis reveals high MSP repeatability with small deviations linked to index variation. These trends provide a framework for interpreting interferometric TTV data and improving metrology practices for SiC substrates.

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Periodical:

Materials Science Forum (Volume 1193)

Pages:

47-54

DOI:

https://doi.org/10.4028/p-3CfRaK

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Cite this paper

Online since:

May 2026

Authors:

David M. Lynch*, Gregory L. Keaton, Christopher A. Lee, Alexander T. Bean

Keywords:

Frequency Scanning Interferometry, Refractive Index Homogeneity, Total Thickness Variation (TTV)

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